XC3S1000-5FG676C

The XC3S1000-5FG676C is a Field Programmable Gate Array (FPGA) chip model manufactured by Xilinx. It is based on the Spartan-3E architecture, and is equipped with 5 million system gates and more than 1,000 I/O pins. It has a 676-pin flip chip BGA package, and its power consumption is 1.2W. It has a maximum clock frequency of 250MHz and a maximum operating temperature of 85°C.

This chip is suitable for a wide range of applications, such as digital signal processing, embedded control, and communications. It is designed to provide a cost-effective solution for applications that require a high level of performance, such as video processing and high-speed data acquisition. It is also suitable for applications that require low power consumption, such as battery-powered and energy-efficient devices.

The XC3S1000-5FG676C chip model is equipped with a variety of features and peripherals, such as embedded RAM, digital clock management, and high-speed transceivers. It is also compatible with the Xilinx ISE Design Suite, which enables users to quickly and easily design, simulate, and deploy their applications. Additionally, the chip is supported by a variety of development boards, such as the Spartan-3E Starter Kit and the Spartan-3E Evaluation Kit, which are used to evaluate and debug the chip.

Overall, the XC3S1000-5FG676C is a powerful FPGA chip model that is suitable for a wide range of applications. It is equipped with a variety of features and peripherals, and is supported by a variety of development boards. It is also designed to provide a cost-effective solution for applications that require a high level of performance and low power consumption.