XC3S1000-4FG676C

The XC3S1000-4FG676C is a field-programmable gate array (FPGA) chip from Xilinx. It is a low-cost, low-power device that is suitable for a variety of applications.

The XC3S1000-4FG676C has a total of 4,096 logic cells, 5,832 flip-flops, and 4,096 Kbits of distributed RAM. It also has 4 clock management tiles and 4 DSP slices. The device is designed with a 676-pin FBGA package. It has a power dissipation of 1.2W and a maximum operating temperature of 85°C.

The XC3S1000-4FG676C is ideal for applications such as industrial automation, consumer electronics, automotive, and military/aerospace. It is also suitable for applications that require low-power, high-performance, and low-cost solutions.

The device is designed with a variety of features such as low-power, low-cost, and high-performance. It also has a wide range of I/O options, including LVDS, LVCMOS, and differential I/O. It also has a wide range of clock management options, including clock jitter attenuation, clock synthesis, and clock distribution.

In summary, the XC3S1000-4FG676C is a low-cost, low-power FPGA chip that is suitable for a variety of applications. It has a wide range of features and I/O options, making it an ideal solution for industrial automation, consumer electronics, automotive, and military/aerospace applications.