AMD Xilinx
XC3195A-1PG175C
XC3195A-1PG175C ECAD Model
XC3195A-1PG175C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 6500 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 1.75 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 6500 GATES | |
| Additional Feature | MAX USABLE 7500 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | CERAMIC, PGA-175 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown |
XC3195A-1PG175C Datasheet Download
XC3195A-1PG175C Overview
The XC3195A-1PG175C chip model is a powerful digital signal processor (DSP) designed for high performance applications in digital signal processing, embedded processing, and image processing. It is capable of performing complex operations at high speed and requires the use of HDL (Hardware Description Language) to program.
The chip model is highly versatile and can be used in a wide range of applications. It is suitable for a variety of scenarios such as communications, automation, and control, as well as for high-end audio and video processing. It is also suitable for applications that require high-speed data processing, such as machine learning and artificial intelligence.
The XC3195A-1PG175C chip model is also suitable for use in networks, as it is capable of handling a wide range of network protocols. It can be used to build intelligent systems that are capable of self-learning and self-adapting, such as autonomous vehicles and smart homes. It can also be used in the era of fully intelligent systems, as it is capable of handling large amounts of data at high speeds.
The industry trends and future development of the XC3195A-1PG175C chip model are largely dependent on what specific technologies are needed. As the chip model is highly versatile, it can be used in a variety of applications and scenarios, and its capabilities can be further enhanced by the addition of new technologies. For example, the chip model can be used with 5G networks, as well as with the Internet of Things, artificial intelligence, and machine learning.
In conclusion, the XC3195A-1PG175C chip model is a powerful DSP that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, communications, automation, and control. It is also capable of handling a variety of network protocols and can be used to build intelligent systems. As new technologies are developed, the capabilities of the chip model can be further enhanced, making it even more suitable for use in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||