AMD Xilinx
XC3195-3PP175C
XC3195-3PP175C ECAD Model
XC3195-3PP175C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 6500 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 6500 GATES | |
| Additional Feature | MAX. 176 I/OS; 1320 FLIP-FLOPS; TYP. GATES = 6500 - 9000 | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PPGA-P175 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 175 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | PGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.937 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA175,16X16 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3195-3PP175C Datasheet Download
XC3195-3PP175C Overview
The XC3195-3PP175C chip model is a high-performance digital signal processor specifically designed to handle the demands of embedded processing, image processing, and other applications. It is designed to be used in conjunction with the HDL (Hardware Description Language) programming language, making it a powerful tool for developers.
The original design intention of the XC3195-3PP175C was to provide a robust, high-performance processor for embedded and image processing applications. It is also designed for easy upgrades, making it a great choice for developers who need to stay ahead of the latest trends and technologies.
The XC3195-3PP175C is also designed to be used in advanced communication systems, making it a great choice for network applications. It is capable of handling high-speed data transfers and complex network protocols, making it a great choice for applications that require high performance. The chip also offers advanced features such as low-power operation, making it an ideal choice for applications that require low power consumption.
The XC3195-3PP175C is also designed with the future in mind. With its advanced features and capabilities, it can be used in a variety of intelligent scenarios, such as autonomous vehicles, smart home systems, and other connected systems. It is also capable of being used in the era of fully intelligent systems, making it a great choice for developers who need to stay ahead of the curve.
Overall, the XC3195-3PP175C chip model is a powerful and versatile processor that is designed to meet the demands of embedded processing, image processing, and other applications. It is designed to be used with the HDL programming language, making it a great choice for developers who need a robust and high-performance processor. It is also designed for easy upgrades, making it a great choice for developers who need to stay ahead of the latest trends and technologies. Additionally, the XC3195-3PP175C is designed to be used in advanced communication systems, making it a great choice for network applications. Finally, it is capable of being used in a variety of intelligent scenarios, making it a great choice for developers who need to stay ahead of the curve in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||