AMD Xilinx
XC3195-3PG175C
XC3195-3PG175C ECAD Model
XC3195-3PG175C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 6500 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 6500 GATES | |
| Additional Feature | MAX. 176 I/OS; 1320 FLIP-FLOPS; TYP. GATES = 6500 - 9000 | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.81 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | CERAMIC, PGA-175 | |
| Pin Count | 175 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC3195-3PG175C Datasheet Download
XC3195-3PG175C Overview
The chip model XC3195-3PG175C is a product of the future, offering an innovative solution to the ongoing evolution of the chip industry. Developed by the renowned chip manufacturer Xilinx, this model is designed to serve as a reliable and powerful processor for various applications. It is equipped with a wide range of features that make it suitable for a variety of tasks, including advanced communication systems, intelligent robots, and more.
In terms of industry trends, the XC3195-3PG175C has already demonstrated its potential to be a game-changer in the chip industry. Its advanced features make it suitable for a wide range of applications, from communications to robotics. Moreover, its user-friendly design allows for easy integration into existing systems, making it an attractive option for businesses in need of an upgrade.
When it comes to future development, the XC3195-3PG175C has the potential to be a leader in the field. Its features are designed to be both powerful and easily upgradable, allowing users to keep up with the latest technology advancements. Additionally, its compatibility with existing technologies will ensure that it can be used in a wide range of applications.
As for the application of the XC3195-3PG175C in the development and popularization of future intelligent robots, the model is a perfect fit. Its features are designed to be both powerful and easily upgradable, making it an ideal choice for robotics projects. Moreover, its user-friendly design allows for easy integration into existing systems, making it an attractive option for businesses in need of an upgrade.
To make full use of the XC3195-3PG175C, however, users need to have the right technical expertise. This includes knowledge of the chip model itself, as well as an understanding of the latest technologies and trends in the chip industry. With the right technical knowledge, users can ensure that they are making the most of the XC3195-3PG175C and its potential to revolutionize the chip industry.
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5,527 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $35.8147 | $35.8147 |
| 10+ | $35.4296 | $354.2957 |
| 100+ | $33.5040 | $3,350.4048 |
| 1000+ | $31.5785 | $15,789.2640 |
| 10000+ | $28.8828 | $28,882.8000 |
| The price is for reference only, please refer to the actual quotation! | ||