AMD Xilinx
XC3190L-2TQ144C
XC3190L-2TQ144C ECAD Model
XC3190L-2TQ144C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 122 | |
| Number of Outputs | 122 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 2.2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | TYP. GATES = 5000-6000 | |
| Clock Frequency-Max | 325 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3190L-2TQ144C Datasheet Download
XC3190L-2TQ144C Overview
The Xilinx XC3190L-2TQ144C is an advanced, high-performance chip model that is suitable for a range of digital signal processing, embedded processing, and image processing applications. It is an ideal choice for those who require the use of HDL language in their projects.
The XC3190L-2TQ144C chip model offers a number of advantages over other models. It is designed with a low-power, high-performance architecture, allowing for faster processing speeds and higher data throughput. Additionally, it features a number of hardware-accelerated features, such as multi-core processors, on-chip memory, and a high-speed serial interface. This allows for increased efficiency when it comes to data processing, resulting in improved performance.
The demand for the XC3190L-2TQ144C model is expected to increase in the future, as it is becoming increasingly popular in a range of industries. It is being used in a variety of applications, ranging from industrial automation to medical imaging. The demand for this model is likely to grow, as it is becoming increasingly necessary for businesses to keep up with the latest technology.
The XC3190L-2TQ144C chip model can be used in the development and popularization of future intelligent robots. This model is ideal for robotics applications, as it is capable of performing complex tasks quickly and efficiently. To use this model effectively, one needs to have a good understanding of HDL language and robotics engineering. Additionally, knowledge of artificial intelligence and machine learning will be beneficial for those who are looking to use the XC3190L-2TQ144C chip model for robotics applications.
In conclusion, the Xilinx XC3190L-2TQ144C chip model is an ideal choice for those who require the use of HDL language in their projects. It offers a number of advantages over other models, and its demand is expected to increase in the future. This model can be used in the development and popularization of future intelligent robots, and those who wish to use it effectively will need to have a good understanding of HDL language and robotics engineering.
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|---|---|---|
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