AMD Xilinx
XC3190A-4TQ144I
XC3190A-4TQ144I ECAD Model
XC3190A-4TQ144I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 122 | |
| Number of Outputs | 122 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 3.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3190A-4TQ144I Datasheet Download
XC3190A-4TQ144I Overview
The Xilinx XC3190A-4TQ144I is a chip model designed to meet the needs of the modern communication industry. It is a powerful integrated circuit that offers a wide range of features and capabilities that make it a suitable choice for various applications. It is designed to provide high performance, high reliability, and low power consumption.
The XC3190A-4TQ144I chip model has a number of advantages that make it an attractive choice for many industries. It is capable of handling high-speed data transfers, making it suitable for applications that require high data throughput. It is also equipped with a high-performance processor and a large memory capacity, allowing it to handle complex tasks. Additionally, it is capable of supporting multiple communication protocols, making it suitable for a variety of applications.
The XC3190A-4TQ144I chip model is expected to experience an increasing demand in the future, as it is suitable for a wide range of applications. It is expected to be used in various communication systems, such as cellular networks, wireless networks, and satellite networks. Additionally, it is expected to be used in the development of various intelligent systems.
The Xilinx XC3190A-4TQ144I chip model was designed with the intention of providing users with a powerful and reliable integrated circuit. It has been designed to be able to support future upgrades, allowing it to keep up with the ever-changing communication industry. Additionally, it is capable of supporting various communication protocols, making it suitable for a variety of applications.
The XC3190A-4TQ144I chip model is expected to be used in a variety of applications in the future. It is expected to be used in networks, such as cellular networks, wireless networks, and satellite networks. Additionally, it is expected to be used in the development of various intelligent systems, such as autonomous vehicles, medical systems, and industrial systems. Furthermore, it is expected to be used in the development of fully intelligent systems, such as the Internet of Things (IoT).
In conclusion, the Xilinx XC3190A-4TQ144I chip model is an integrated circuit that is designed to provide users with a powerful and reliable solution. It is expected to experience an increasing demand in the future, as it is suitable for a wide range of applications. Additionally, it is capable of supporting future upgrades, making it suitable for the ever-changing communication industry. Finally, it is expected to be used in a variety of applications in the future, such as networks, intelligent systems, and fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
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