AMD Xilinx
XC3190A-4PG175C
XC3190A-4PG175C ECAD Model
XC3190A-4PG175C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 3.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | CERAMIC, PGA-175 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3190A-4PG175C Datasheet Download
XC3190A-4PG175C Overview
The Xilinx XC3190A-4PG175C chip model is a powerful and versatile integrated circuit (IC) designed for high-performance digital signal processing, embedded processing, and image processing. This chip model is a great choice for those looking for enhanced performance in their next project.
The XC3190A-4PG175C chip model is programmed in the Hardware Description Language (HDL) which is a language specifically designed for programming digital circuits. HDL allows for the design of complex digital systems in a more efficient and organized manner. The XC3190A-4PG175C chip model is a great choice for those looking to take advantage of the latest in digital technology.
The XC3190A-4PG175C chip model has a number of advantages that make it an ideal choice for a variety of projects. It is capable of handling high-speed data, has a low power consumption, and is highly configurable. Furthermore, it is designed to be compatible with a variety of operating systems. This makes it a great choice for those looking for a chip model that is versatile and can be used in a variety of applications.
As the digital industry continues to evolve, the demand for the XC3190A-4PG175C chip model is expected to increase. This is due to the chip's ability to handle high-speed data, its low power consumption, and its compatibility with a variety of operating systems. Furthermore, as new technologies are developed, the XC3190A-4PG175C chip model is expected to be able to take advantage of them. This makes it a great choice for those looking to stay ahead of the curve.
In conclusion, the Xilinx XC3190A-4PG175C chip model is a powerful and versatile integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is programmed in the Hardware Description Language (HDL) and is capable of handling high-speed data, has a low power consumption, and is highly configurable. Furthermore, it is designed to be compatible with a variety of operating systems. As the digital industry continues to evolve, the demand for the XC3190A-4PG175C chip model is expected to increase and it is expected to be able to take advantage of new technologies as they are developed.
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| No reference price found. | ||