AMD Xilinx
XC3190A-4PG175B
XC3190A-4PG175B ECAD Model
XC3190A-4PG175B Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 3.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, | |
| Pin Count | 175 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
XC3190A-4PG175B Datasheet Download
XC3190A-4PG175B Overview
The XC3190A-4PG175B chip model is a versatile and powerful semiconductor device that is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with a Hardware Description Language (HDL) to program and control the device.
The original design of the XC3190A-4PG175B chip model was to provide a powerful platform for advanced communication systems. It is capable of handling complex signal processing tasks and is highly customizable to meet the needs of the user. The chip model also has the potential to be upgraded in the future, allowing for increased performance and more advanced features.
The XC3190A-4PG175B chip model is capable of being used in a wide range of networks, including wireless networks, cellular networks, and even the Internet of Things. It can be used to build powerful and reliable communication systems, as well as intelligent systems. It is also capable of being used in the era of fully intelligent systems, such as the Internet of Things, where it can be used to control and monitor connected devices.
The XC3190A-4PG175B chip model is an ideal choice for those who need a powerful and reliable semiconductor device that is capable of handling complex signal processing tasks. It is capable of being used in a wide range of networks and can be used to build powerful communication systems and intelligent systems. With its potential for future upgrades, this chip model is an excellent choice for those looking for a versatile and powerful semiconductor device.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||