AMD Xilinx
XC3190A-3TQ144C
XC3190A-3TQ144C ECAD Model
XC3190A-3TQ144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 122 | |
| Number of Outputs | 122 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3190A-3TQ144C Datasheet Download
XC3190A-3TQ144C Overview
The XC3190A-3TQ144C chip model is a powerful and versatile chip that is suitable for a range of applications, including high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language for its programming.
The chip model is being used in a variety of industries, and the future development of these industries will depend on what specific technologies they require. The chip model can be applied in networks and intelligent scenarios, and it is possible to use it in the era of fully intelligent systems.
The XC3190A-3TQ144C chip model is a powerful and versatile chip that can be used in a variety of applications. It is capable of handling complex operations and is suitable for high-performance digital signal processing, embedded processing, and image processing. This chip model requires the use of HDL language for its programming, which allows for the development of complex applications.
The chip model is being used in a variety of industries, and the future development of these industries will depend on what specific technologies they require. For example, the chip model can be used for network applications and for intelligent scenarios. It is possible to use it in the era of fully intelligent systems, such as artificial intelligence, machine learning, and natural language processing.
The XC3190A-3TQ144C chip model is a powerful and versatile chip that can be used for a variety of applications. It is capable of handling complex operations and is suitable for high-performance digital signal processing, embedded processing, and image processing. This chip model requires the use of HDL language for its programming, which allows for the development of complex applications. The chip model is being used in a variety of industries, and the future development of these industries will depend on what specific technologies they require. It is possible to use the chip model in networks and intelligent scenarios, and in the era of fully intelligent systems, such as artificial intelligence, machine learning, and natural language processing. The XC3190A-3TQ144C chip model is a powerful and versatile chip that can be used to power the next generation of intelligent systems.
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|---|---|---|
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