AMD Xilinx
XC3190A-3PG175C
XC3190A-3PG175C ECAD Model
XC3190A-3PG175C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | CERAMIC, PGA-175 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3190A-3PG175C Datasheet Download
XC3190A-3PG175C Overview
The XC3190A-3PG175C chip model is a highly advanced integrated circuit designed for use in networking and intelligent systems. It is capable of providing a wide range of features and functions, including high-speed communications, data storage, and computational processing. It is also capable of running complex algorithms and applications, making it suitable for use in the development and popularization of future intelligent robots.
The XC3190A-3PG175C chip model is designed to meet the demands of modern networks and intelligent systems. It has a wide range of features and functions, including high-speed communications, data storage, and computational processing. It is also capable of running complex algorithms and applications, making it suitable for use in the development and popularization of future intelligent robots.
The XC3190A-3PG175C chip model is capable of providing a wide range of features and functions, including high-speed communications, data storage, and computational processing. It is also capable of running complex algorithms and applications, making it suitable for use in the development and popularization of future intelligent robots. It is also capable of providing a high level of reliability and security, making it suitable for use in the era of fully intelligent systems.
The XC3190A-3PG175C chip model is designed to meet the demands of modern networks and intelligent systems. It is capable of providing a wide range of features and functions, including high-speed communications, data storage, and computational processing. It is also capable of running complex algorithms and applications, making it suitable for use in the development and popularization of future intelligent robots.
The product description and specific design requirements of the XC3190A-3PG175C chip model include a wide range of features and functions, including high-speed communications, data storage, and computational processing. It is also capable of running complex algorithms and applications, making it suitable for use in the development and popularization of future intelligent robots.
The XC3190A-3PG175C chip model has been successfully applied in actual case studies, providing a high level of reliability and security. It is also capable of providing a wide range of features and functions, including high-speed communications, data storage, and computational processing. It is also capable of running complex algorithms and applications, making it suitable for use in the development and popularization of future intelligent robots.
The XC3190A-3PG175C chip model is suitable for use in the era of fully intelligent systems, as it is capable of providing a high level of reliability and security. It is also capable of running complex algorithms and applications, making it suitable for use in the development and popularization of future intelligent robots.
In order to effectively use the XC3190A-3PG175C chip model, it is important to have a good understanding of its features and functions, as well as its design requirements. Technical talents with expertise in networking, intelligent systems, and robotics are essential in order to use the model effectively. It is also important to have a good understanding of the principles of programming, as well as the algorithms and applications that can be used with the model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||