
AMD Xilinx
XC3190A-2PQG160I
XC3190A-2PQG160I ECAD Model
XC3190A-2PQG160I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 5000 | |
Number of CLBs | 320 | |
Combinatorial Delay of a CLB-Max | 2.2 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 320 CLBS, 5000 GATES | |
Additional Feature | MAX USABLE 6000 LOGIC GATES | |
Clock Frequency-Max | 323 MHz | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PQFP-G160 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 160 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP, | |
Pin Count | 160 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC3190A-2PQG160I Datasheet Download
XC3190A-2PQG160I Overview
The Xilinx XC3190A-2PQG160I chip model is a programmable logic device that is designed to meet the needs of a wide range of applications. It is an FPGA (Field Programmable Gate Array) that combines the benefits of both ASICs (Application Specific Integrated Circuits) and PLDs (Programmable Logic Devices) in one chip. Its original design intention was to provide users with a high-performance, low-cost, and readily available platform for their designs.
The Xilinx XC3190A-2PQG160I chip model is a high-end FPGA that can be used for a variety of applications, such as communications, embedded systems, and industrial automation. It is capable of providing up to 160K gates of logic, and can support up to 1.2 million system gates. It is also equipped with a variety of features, such as high-speed I/O, high-speed memory, and high-speed clock management.
The Xilinx XC3190A-2PQG160I chip model is also capable of being upgraded to meet the needs of advanced communication systems. It can be upgraded to support higher speed and higher capacity memory, as well as additional features such as multi-channel communication and advanced encryption. Additionally, it can be customized to support the development and popularization of future intelligent robots.
In order to use the Xilinx XC3190A-2PQG160I chip model effectively, it is important to understand its product description and specific design requirements. It is also important to consider the actual case studies and precautions when using the chip model. Additionally, technical talents such as software engineers, hardware engineers, and system architects are needed to use the model effectively.
In conclusion, the Xilinx XC3190A-2PQG160I chip model is a high-performance, low-cost, and readily available platform for a variety of applications. It can be upgraded to support advanced communication systems, and can also be customized to support the development and popularization of future intelligent robots. In order to use the chip model effectively, it is important to understand its product description and specific design requirements, as well as consider the actual case studies and precautions. Technical talents such as software engineers, hardware engineers, and system architects are also needed to use the model effectively.
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