XC3190A-2PQG160I
XC3190A-2PQG160I
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rohs

AMD Xilinx

XC3190A-2PQG160I


XC3190A-2PQG160I
F20-XC3190A-2PQG160I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, QFP
QFP

XC3190A-2PQG160I ECAD Model


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XC3190A-2PQG160I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Equivalent Gates 5000
Number of CLBs 320
Combinatorial Delay of a CLB-Max 2.2 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 320 CLBS, 5000 GATES
Additional Feature MAX USABLE 6000 LOGIC GATES
Clock Frequency-Max 323 MHz
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
JESD-30 Code S-PQFP-G160
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 160
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Shape SQUARE
Package Style FLATPACK
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 650 µm
Terminal Position QUAD
Width 28 mm
Length 28 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description QFP,
Pin Count 160
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC3190A-2PQG160I Datasheet Download


XC3190A-2PQG160I Overview



The Xilinx XC3190A-2PQG160I chip model is a programmable logic device that is designed to meet the needs of a wide range of applications. It is an FPGA (Field Programmable Gate Array) that combines the benefits of both ASICs (Application Specific Integrated Circuits) and PLDs (Programmable Logic Devices) in one chip. Its original design intention was to provide users with a high-performance, low-cost, and readily available platform for their designs.


The Xilinx XC3190A-2PQG160I chip model is a high-end FPGA that can be used for a variety of applications, such as communications, embedded systems, and industrial automation. It is capable of providing up to 160K gates of logic, and can support up to 1.2 million system gates. It is also equipped with a variety of features, such as high-speed I/O, high-speed memory, and high-speed clock management.


The Xilinx XC3190A-2PQG160I chip model is also capable of being upgraded to meet the needs of advanced communication systems. It can be upgraded to support higher speed and higher capacity memory, as well as additional features such as multi-channel communication and advanced encryption. Additionally, it can be customized to support the development and popularization of future intelligent robots.


In order to use the Xilinx XC3190A-2PQG160I chip model effectively, it is important to understand its product description and specific design requirements. It is also important to consider the actual case studies and precautions when using the chip model. Additionally, technical talents such as software engineers, hardware engineers, and system architects are needed to use the model effectively.


In conclusion, the Xilinx XC3190A-2PQG160I chip model is a high-performance, low-cost, and readily available platform for a variety of applications. It can be upgraded to support advanced communication systems, and can also be customized to support the development and popularization of future intelligent robots. In order to use the chip model effectively, it is important to understand its product description and specific design requirements, as well as consider the actual case studies and precautions. Technical talents such as software engineers, hardware engineers, and system architects are also needed to use the model effectively.



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