
AMD Xilinx
XC3190A-2PQG160C
XC3190A-2PQG160C ECAD Model
XC3190A-2PQG160C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 5000 | |
Number of CLBs | 320 | |
Combinatorial Delay of a CLB-Max | 2.2 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 320 CLBS, 5000 GATES | |
Additional Feature | MAX USABLE 6000 LOGIC GATES | |
Clock Frequency-Max | 323 MHz | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G160 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 160 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP, | |
Pin Count | 160 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC3190A-2PQG160C Datasheet Download
XC3190A-2PQG160C Overview
The XC3190A-2PQG160C chip model is a powerful digital signal processor (DSP) designed for high-performance applications such as embedded processing, image processing, and other advanced signal processing tasks. It is capable of handling complex tasks with ease, and is programmed using the HDL language. This chip model is suitable for use in a variety of applications and scenarios, from basic data processing to more sophisticated signal processing and image processing tasks.
The XC3190A-2PQG160C chip model is an ideal choice for use in modern networks, as it is capable of handling large amounts of data quickly and efficiently. It can be used for intelligent tasks such as facial recognition, object recognition, and context-aware applications. It is also suitable for use in the era of fully intelligent systems, such as autonomous vehicles, smart homes, and intelligent industrial systems.
The product description of the XC3190A-2PQG160C chip model includes a range of features, such as a high-performance processor, a large memory size, and an efficient power consumption. The chip is also capable of handling a variety of tasks, from basic data processing to more complex signal processing tasks. To ensure that the chip model is used correctly, it is important to understand the specific design requirements and the precautions that must be taken when using it.
Case studies can also be used to gain a better understanding of the XC3190A-2PQG160C chip model. These case studies can provide insight into how the chip model can be used in real-world applications, as well as the advantages and disadvantages of using the chip model. By understanding the product description, design requirements, and case studies of the XC3190A-2PQG160C chip model, users can make an informed decision when choosing a chip model for their application.
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