XC3190A-2PQG160C
XC3190A-2PQG160C
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rohs

AMD Xilinx

XC3190A-2PQG160C


XC3190A-2PQG160C
F20-XC3190A-2PQG160C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, QFP
QFP

XC3190A-2PQG160C ECAD Model


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XC3190A-2PQG160C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Equivalent Gates 5000
Number of CLBs 320
Combinatorial Delay of a CLB-Max 2.2 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 320 CLBS, 5000 GATES
Additional Feature MAX USABLE 6000 LOGIC GATES
Clock Frequency-Max 323 MHz
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-PQFP-G160
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 160
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Shape SQUARE
Package Style FLATPACK
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 650 µm
Terminal Position QUAD
Width 28 mm
Length 28 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description QFP,
Pin Count 160
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC3190A-2PQG160C Datasheet Download


XC3190A-2PQG160C Overview



The XC3190A-2PQG160C chip model is a powerful digital signal processor (DSP) designed for high-performance applications such as embedded processing, image processing, and other advanced signal processing tasks. It is capable of handling complex tasks with ease, and is programmed using the HDL language. This chip model is suitable for use in a variety of applications and scenarios, from basic data processing to more sophisticated signal processing and image processing tasks.


The XC3190A-2PQG160C chip model is an ideal choice for use in modern networks, as it is capable of handling large amounts of data quickly and efficiently. It can be used for intelligent tasks such as facial recognition, object recognition, and context-aware applications. It is also suitable for use in the era of fully intelligent systems, such as autonomous vehicles, smart homes, and intelligent industrial systems.


The product description of the XC3190A-2PQG160C chip model includes a range of features, such as a high-performance processor, a large memory size, and an efficient power consumption. The chip is also capable of handling a variety of tasks, from basic data processing to more complex signal processing tasks. To ensure that the chip model is used correctly, it is important to understand the specific design requirements and the precautions that must be taken when using it.


Case studies can also be used to gain a better understanding of the XC3190A-2PQG160C chip model. These case studies can provide insight into how the chip model can be used in real-world applications, as well as the advantages and disadvantages of using the chip model. By understanding the product description, design requirements, and case studies of the XC3190A-2PQG160C chip model, users can make an informed decision when choosing a chip model for their application.



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