AMD Xilinx
XC3190A-2PG175I
XC3190A-2PG175I ECAD Model
XC3190A-2PG175I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 2.2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | CERAMIC, PGA-175 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3190A-2PG175I Datasheet Download
XC3190A-2PG175I Overview
The XC3190A-2PG175I chip model is a powerful and versatile integrated circuit that has been widely used in a variety of industries. It is currently the most popular model in the market, and its advantages have been widely acknowledged by users. The chip model has a wide range of features, including a high processing speed, low power consumption, and a high degree of integration.
The XC3190A-2PG175I chip model is well suited for applications in the fields of communication, network, and industrial automation. Its high processing speed and low power consumption make it an ideal choice for applications that require high performance and energy efficiency. In addition, its high degree of integration allows for the development of complex systems with minimal hardware components.
The demand for the XC3190A-2PG175I chip model is expected to remain strong in the future as the demand for advanced technologies continues to increase. This chip model is well suited for the development of intelligent systems, as it can be used to process large amounts of data quickly and accurately. It can also be used in networks to provide reliable and secure connections. Furthermore, it can be used in the era of fully intelligent systems to provide a high level of control and automation.
The XC3190A-2PG175I chip model is a powerful and versatile integrated circuit that has many potential applications in the future. It is well suited for applications in communication, network, and industrial automation due to its high processing speed and low power consumption. In addition, it is well suited for the development of intelligent systems, as it can be used to process large amounts of data quickly and accurately. Finally, it can be used in the era of fully intelligent systems to provide a high level of control and automation. With its wide range of features and potential applications, the XC3190A-2PG175I chip model is expected to remain in high demand in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||