AMD Xilinx
XC3190A-2PG175C
XC3190A-2PG175C ECAD Model
XC3190A-2PG175C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 2.2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | CERAMIC, PGA-175 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3190A-2PG175C Datasheet Download
XC3190A-2PG175C Overview
Xilinx's XC3190A-2PG175C chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, allowing users to create complex and highly efficient designs. It has been used in a variety of applications, from industrial automation to medical imaging, and is a popular choice among engineers.
The XC3190A-2PG175C chip model was designed with the intention of future upgrades. It is capable of being upgraded to support more complex algorithms and provide higher performance. This makes it suitable for use in advanced communication systems, such as those used in 5G networks and beyond. It is also capable of being used in intelligent scenarios, such as autonomous vehicles and smart home systems.
The XC3190A-2PG175C chip model is a powerful and versatile tool that can be used in a variety of applications. It is capable of supporting complex algorithms and providing high performance, making it suitable for use in advanced communication systems and intelligent scenarios. This makes it a great choice for use in the era of fully intelligent systems, where it can be used to create powerful and efficient designs. With its ability to be upgraded and used in a variety of applications, the XC3190A-2PG175C chip model is an ideal choice for engineers looking to create powerful and efficient designs.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||