AMD Xilinx
XC3190A-1PQ160C
XC3190A-1PQ160C ECAD Model
XC3190A-1PQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 138 | |
| Number of Outputs | 138 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 1.75 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3190A-1PQ160C Datasheet Download
XC3190A-1PQ160C Overview
The XC3190A-1PQ160C chip model is a programmable logic device (PLD) that is developed and manufactured by Xilinx. It is a high-performance, low-power, and cost-effective solution for embedded systems. The chip model is designed to provide a wide range of features, including an optimized logic architecture, advanced memory technology, and an integrated power management system.
The XC3190A-1PQ160C chip model has the potential to be used in many different industries. It can be used in the automotive, aerospace, medical, industrial, and consumer electronics sectors. It can also be used in various communication systems, such as Wi-Fi, Bluetooth, and 4G/5G networks. The chip model is also suitable for applications that require high-speed data transfer and processing, such as video streaming, gaming, and artificial intelligence.
The XC3190A-1PQ160C chip model is capable of supporting the development of future intelligent robots. It is equipped with a powerful processor that can handle complex tasks, as well as a variety of sensors, actuators, and communication protocols that can be used to interact with the environment. The chip model also supports advanced programming languages, such as C/C++, Java, and Python, which makes it easier for developers to create complex applications.
In order to effectively use the XC3190A-1PQ160C chip model, a certain level of technical expertise is required. This includes knowledge of digital design, embedded systems, and programming languages. Additionally, a solid understanding of the chip model’s features, as well as its application in different industries, is necessary.
The XC3190A-1PQ160C chip model is designed to be flexible and upgradeable. It is capable of supporting new technologies and applications, as well as being adapted to different environments. The chip model can also be used in conjunction with other components, such as microcontrollers, memory, and communication interfaces, to create more advanced systems.
Overall, the XC3190A-1PQ160C chip model is a powerful and cost-effective solution for embedded systems. It is capable of supporting the development of future intelligent robots, as well as being used in various communication systems. In order to use the chip model effectively, a certain level of technical expertise is required. Additionally, the chip model is designed to be flexible and upgradeable, so it can be adapted to different environments and used with other components.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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