AMD Xilinx
XC3190A-1PG175C
XC3190A-1PG175C ECAD Model
XC3190A-1PG175C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 1.75 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | CERAMIC, PGA-175 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3190A-1PG175C Datasheet Download
XC3190A-1PG175C Overview
The XC3190A-1PG175C chip model is a powerful and versatile processor, designed to be used in a variety of digital signal processing, embedded processing, and image processing applications. It is a highly efficient processor that is capable of performing complex tasks with minimal power consumption. The chip model is programmed using HDL (Hardware Description Language) and is designed to be easily upgradable to meet the changing needs of the user.
The XC3190A-1PG175C is a great choice for advanced communication systems. It can easily handle the high-speed data rates required for modern networks and is capable of supporting a wide range of applications. It is also suitable for use in intelligent systems, such as those used in autonomous vehicles, robotics, and machine learning. The chip model is also capable of being used in the era of fully intelligent systems, as it can be programmed to process data quickly and accurately.
In addition, the XC3190A-1PG175C is also a great choice for applications requiring high performance and reliability. It is capable of handling large amounts of data quickly and accurately, making it ideal for use in complex systems. It also has excellent power efficiency, making it an ideal choice for applications where battery life is a concern.
Overall, the XC3190A-1PG175C chip model is a great choice for a wide range of applications, from communication systems to intelligent systems. It is designed to be easily upgradable and is capable of handling high-speed data rates and large amounts of data. It is also capable of being used in the era of fully intelligent systems, making it a great choice for any application requiring high performance and reliability.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||