AMD Xilinx
XC3190A-09TQ144C
XC3190A-09TQ144C ECAD Model
XC3190A-09TQ144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 122 | |
| Number of Outputs | 122 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 1.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 370 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3190A-09TQ144C Datasheet Download
XC3190A-09TQ144C Overview
The XC3190A-09TQ144C chip model is a high-performance chip designed to meet the needs of a variety of digital signal processing, embedded processing, and image processing applications. It is designed to be programmed using the HDL (Hardware Description Language) language, which is a powerful tool for designing and programming digital logic circuits.
The XC3190A-09TQ144C chip model was originally designed to provide a high-performance platform for applications that require efficient digital signal processing. It is capable of performing complex tasks such as image processing, embedded processing, and other similar operations. Additionally, its design allows for future upgrades and expansions, giving it the potential to be used in more advanced communication systems.
The XC3190A-09TQ144C chip model is also well-suited for the development and popularization of future intelligent robots. Its powerful processing capabilities and the ability to be programmed with HDL language make it an ideal choice for the development of robots that can perform complex tasks. In order to use the XC3190A-09TQ144C chip model effectively, technical talents such as software engineers, hardware engineers, and robotics engineers are needed.
Overall, the XC3190A-09TQ144C chip model is a powerful and versatile tool that can be used in a variety of applications. It can be used for high-performance digital signal processing, embedded processing, image processing, and even the development and popularization of future intelligent robots. Its design allows for future upgrades and expansions, making it a great choice for those who want to stay on the cutting edge of technology.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||