AMD Xilinx
XC3190A-09PQ160C
XC3190A-09PQ160C ECAD Model
XC3190A-09PQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 138 | |
| Number of Outputs | 138 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 1.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 370 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | QFP, QFP160,1.2SQ | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Pin Count | 160 |
XC3190A-09PQ160C Datasheet Download
XC3190A-09PQ160C Overview
The chip model XC3190A-09PQ160C is a new breakthrough in technology, allowing for a wide range of applications in networks and intelligent systems. It is a low-power, high-performance programmable logic device (PLD) with a range of integrated features, including 16K bits of embedded RAM and 160K bits of programmable logic. It is ideal for embedded applications in a wide range of industries, including industrial automation, medical devices, automotive, consumer electronics, and aerospace.
In terms of industry trends, the XC3190A-09PQ160C chip model is expected to be widely used in the near future. It is designed to be compatible with the latest technologies, such as the Internet of Things (IoT) and artificial intelligence (AI). This chip model is capable of supporting a variety of intelligent scenarios, such as voice control, facial recognition, and motion control. It can also be used in fully intelligent systems, such as smart homes, intelligent transportation systems, and smart cities.
The product description of the XC3190A-09PQ160C chip model includes its general features, such as its low power consumption, high performance, and wide range of integrated features. It also includes its specific design requirements, such as the number of pins, the clock frequency, and the number of logic cells. In addition, this chip model includes actual case studies and precautions, such as the recommended operating temperature, the maximum current draw, and the power-up sequence.
Overall, the XC3190A-09PQ160C chip model is a powerful and versatile chip model that is expected to be widely used in the near future. It is designed to be compatible with the latest technologies, such as the Internet of Things and artificial intelligence, and it is capable of supporting a variety of intelligent scenarios. It also includes its general features, specific design requirements, and actual case studies and precautions. With its wide range of features and capabilities, the XC3190A-09PQ160C chip model is sure to be a valuable asset in the future development of the industry.
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|---|---|---|
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