XC3190A-09PG175C
XC3190A-09PG175C
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rohs

AMD Xilinx

XC3190A-09PG175C


XC3190A-09PG175C
F20-XC3190A-09PG175C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, CERAMIC, PGA-175
CERAMIC, PGA-175

XC3190A-09PG175C ECAD Model


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XC3190A-09PG175C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 144
Number of Outputs 144
Number of Logic Cells 320
Number of Equivalent Gates 5000
Number of CLBs 320
Combinatorial Delay of a CLB-Max 1.5 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 320 CLBS, 5000 GATES
Additional Feature MAX USABLE 6000 LOGIC GATES
Clock Frequency-Max 370 MHz
Power Supplies 5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-CPGA-P175
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 175
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code HPGA
Package Equivalence Code PGA175,16X16
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Surface Mount NO
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 42.164 mm
Length 42.164 mm
Seated Height-Max 4.318 mm
Ihs Manufacturer XILINX INC
Package Description CERAMIC, PGA-175
Reach Compliance Code unknown
HTS Code 8542.39.00.01
Part Package Code PGA
Pin Count 175

XC3190A-09PG175C Datasheet Download


XC3190A-09PG175C Overview



The XC3190A-09PG175C chip model is a cutting-edge product from Xilinx, a well-known semiconductor company. It is designed for high-performance applications, especially in the field of advanced communication systems. It is equipped with a wide range of features and capabilities, including an embedded processor, a large number of I/Os, and a high-speed memory interface.


The original design intention of the XC3190A-09PG175C chip model is to provide users with a powerful platform for building advanced communication systems. It is capable of handling a variety of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and more. The chip model also features a high-speed memory interface, allowing for fast data transfer and efficient data processing. Furthermore, the XC3190A-09PG175C chip model is designed to be easily upgradable, allowing users to add new features and capabilities as needed.


In addition to its applications in communication systems, the XC3190A-09PG175C chip model can be used in a variety of intelligent scenarios. It is capable of handling complex tasks, such as natural language processing, machine learning, and image recognition. Furthermore, it can be used to develop and popularize future intelligent robots, allowing users to create autonomous machines with advanced capabilities.


In order to make full use of the XC3190A-09PG175C chip model, it is important to have a good understanding of its features and capabilities. A team of technical talents is required to successfully utilize the chip model, as they must be familiar with the various aspects of its design, including the embedded processor, I/Os, and memory interface. Furthermore, they must also be able to integrate the chip model into existing systems and networks.


Overall, the XC3190A-09PG175C chip model is a powerful and versatile product from Xilinx. It is designed for high-performance applications, especially in the field of advanced communication systems. Furthermore, it can be used in a variety of intelligent scenarios, including natural language processing, machine learning, and image recognition. With the help of a team of technical talents, the XC3190A-09PG175C chip model can be used to develop and popularize future intelligent robots.



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