
AMD Xilinx
XC3190A-09PG175C
XC3190A-09PG175C ECAD Model
XC3190A-09PG175C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 144 | |
Number of Outputs | 144 | |
Number of Logic Cells | 320 | |
Number of Equivalent Gates | 5000 | |
Number of CLBs | 320 | |
Combinatorial Delay of a CLB-Max | 1.5 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 320 CLBS, 5000 GATES | |
Additional Feature | MAX USABLE 6000 LOGIC GATES | |
Clock Frequency-Max | 370 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-CPGA-P175 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 175 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | HPGA | |
Package Equivalence Code | PGA175,16X16 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Surface Mount | NO | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 42.164 mm | |
Length | 42.164 mm | |
Seated Height-Max | 4.318 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | CERAMIC, PGA-175 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Part Package Code | PGA | |
Pin Count | 175 |
XC3190A-09PG175C Datasheet Download
XC3190A-09PG175C Overview
The XC3190A-09PG175C chip model is a cutting-edge product from Xilinx, a well-known semiconductor company. It is designed for high-performance applications, especially in the field of advanced communication systems. It is equipped with a wide range of features and capabilities, including an embedded processor, a large number of I/Os, and a high-speed memory interface.
The original design intention of the XC3190A-09PG175C chip model is to provide users with a powerful platform for building advanced communication systems. It is capable of handling a variety of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and more. The chip model also features a high-speed memory interface, allowing for fast data transfer and efficient data processing. Furthermore, the XC3190A-09PG175C chip model is designed to be easily upgradable, allowing users to add new features and capabilities as needed.
In addition to its applications in communication systems, the XC3190A-09PG175C chip model can be used in a variety of intelligent scenarios. It is capable of handling complex tasks, such as natural language processing, machine learning, and image recognition. Furthermore, it can be used to develop and popularize future intelligent robots, allowing users to create autonomous machines with advanced capabilities.
In order to make full use of the XC3190A-09PG175C chip model, it is important to have a good understanding of its features and capabilities. A team of technical talents is required to successfully utilize the chip model, as they must be familiar with the various aspects of its design, including the embedded processor, I/Os, and memory interface. Furthermore, they must also be able to integrate the chip model into existing systems and networks.
Overall, the XC3190A-09PG175C chip model is a powerful and versatile product from Xilinx. It is designed for high-performance applications, especially in the field of advanced communication systems. Furthermore, it can be used in a variety of intelligent scenarios, including natural language processing, machine learning, and image recognition. With the help of a team of technical talents, the XC3190A-09PG175C chip model can be used to develop and popularize future intelligent robots.
You May Also Be Interested In
4,259 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
No reference price found. |