AMD Xilinx
XC3190-5PG175I
XC3190-5PG175I ECAD Model
XC3190-5PG175I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 4.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX. 144 I/OS; 928 FLIP-FLOPS; TYP. GATES = 5000 - 7500 | |
| Clock Frequency-Max | 190 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.81 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | CERAMIC, PGA-175 | |
| Pin Count | 175 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC3190-5PG175I Datasheet Download
XC3190-5PG175I Overview
The XC3190-5PG175I chip model is a highly advanced integrated circuit designed to meet the needs of modern communication systems. It is a powerful and versatile chip that can be used in a variety of applications, from low-power embedded systems to high-end communication systems. It is designed to provide a high level of performance, reliability, and scalability.
The chip model XC3190-5PG175I has been designed with a range of features and capabilities that make it an ideal choice for a variety of communication systems. It is capable of handling a wide range of data rates and can be used for both wired and wireless applications. It is also designed to be highly configurable and can be adapted to fit different system requirements. The chip model is also designed to be highly reliable and can be used in a variety of harsh environments.
The XC3190-5PG175I chip model is designed to be highly scalable and can be used in a variety of communication systems. It is capable of supporting a variety of technologies and can be used for both wired and wireless applications. It is also designed to provide a high level of performance and reliability. The chip model is also designed to be highly configurable and can be adapted to fit different system requirements.
The XC3190-5PG175I chip model is designed to be highly reliable and can be used in a variety of harsh environments. It is designed to be highly configurable and can be adapted to fit different system requirements. The chip model is also designed to be highly scalable and can be used in a variety of communication systems. It is capable of supporting a variety of technologies and can be used for both wired and wireless applications.
The XC3190-5PG175I chip model is designed to be highly reliable and can be used in a variety of harsh environments. It is also designed to be highly configurable and can be adapted to fit different system requirements. The chip model is also designed to be highly scalable and can be used in a variety of communication systems. It is capable of supporting a variety of technologies and can be used for both wired and wireless applications.
The XC3190-5PG175I chip model is designed to be highly reliable and can be used in a variety of harsh environments. It is also designed to be highly configurable and can be adapted to fit different system requirements. The chip model is also designed to be highly scalable and can be used in a variety of communication systems. It is capable of supporting a variety of technologies and can be used for both wired and wireless applications.
The XC3190-5PG175I chip model is designed to be highly reliable and can be used in a variety of harsh environments. It is also designed to be highly configurable and can be adapted to fit different system requirements. The chip model is also designed to be highly scalable and can be used in a variety of communication systems. It is capable of supporting a variety of technologies and can be used for both wired and wireless applications.
The XC3190-5PG175I chip model is designed to be highly reliable and can be used in a variety of harsh environments. It is also designed to be highly configurable and can be adapted to fit different system requirements. The chip model is also designed to be highly scalable and can be used in a variety of communication systems. It is capable of supporting a variety of technologies and can be used for both wired and wireless applications.
When it comes to industry trends, the XC3190-5PG175I chip model is designed to be highly reliable and can be used in a variety of harsh environments. It is also designed to be highly configurable and can be adapted to fit different system requirements. The chip model is also designed to be highly scalable and can be used in a variety of communication systems. It is capable of supporting a variety of technologies and can be used for both wired and wireless applications.
In terms of future development, the XC3190-5PG175I chip model is designed to be highly reliable and can be used in a variety of harsh environments. It is also designed to be highly configurable and can be adapted to fit different system requirements. The chip model is also designed to be highly scalable and can be used in a variety of communication systems. It is capable of supporting a variety of technologies and can be used for both wired and wireless applications.
Whether the application environment requires the support of new technologies depends on what specific technologies are needed. The XC3190-5PG175I chip model is designed to be highly reliable and can be used in a variety of harsh environments. It is also designed to be highly configurable and can be adapted to fit different system requirements. The chip model is also designed to be highly scalable and can be used in a variety of communication systems. It is capable of supporting a variety of technologies and can be used for both wired and wireless applications.
The original design
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4,509 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $22.7246 | $22.7246 |
| 10+ | $22.4803 | $224.8029 |
| 100+ | $21.2585 | $2,125.8537 |
| 1000+ | $20.0368 | $10,018.3910 |
| 10000+ | $18.3263 | $18,326.3250 |
| The price is for reference only, please refer to the actual quotation! | ||