AMD Xilinx
XC3190-3PG175C
XC3190-3PG175C ECAD Model
XC3190-3PG175C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX. 144 I/OS; 928 FLIP-FLOPS; TYP. GATES = 5000 - 7500 | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.81 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | CERAMIC, PGA-175 | |
| Pin Count | 175 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC3190-3PG175C Datasheet Download
XC3190-3PG175C Overview
The XC3190-3PG175C chip model is a powerful and versatile model that has been designed to meet the needs of the modern technology industry. It is capable of performing a wide range of tasks, from basic data processing to complex computing and networking applications. This model is also equipped with advanced features such as high-speed data transfer and a comprehensive set of tools for customizing the design.
The XC3190-3PG175C chip model is part of an ever-evolving industry, and its capabilities are constantly being updated to meet the changing needs of the modern world. As the technology industry continues to evolve, the XC3190-3PG175C chip model is expected to remain an important component of the industry.
In terms of industry trends, the XC3190-3PG175C chip model is expected to be used in a variety of applications. For example, it can be used in networks to improve data transfer speeds, reduce latency, and improve overall performance. It can also be used in intelligent scenarios such as facial recognition and natural language processing. In the future, the XC3190-3PG175C chip model is expected to be used in fully intelligent systems, such as autonomous vehicles and smart homes.
In order to ensure that the XC3190-3PG175C chip model is compatible with the application environment, it is important to understand the product description and specific design requirements. The product description outlines the features, capabilities, and limitations of the XC3190-3PG175C chip model. It is important to note that the chip model is designed to be compatible with a wide range of applications, so it is important to read the product description carefully to ensure that it meets the requirements of the application.
In addition to understanding the product description, it is also important to consider actual case studies and precautions when using the XC3190-3PG175C chip model. Case studies can provide valuable insight into how the chip model can be used in real-world applications. It is also important to understand the precautions that must be taken when using the chip model, such as avoiding overloading the system or using the chip model in temperatures that are too high or too low.
Overall, the XC3190-3PG175C chip model is a powerful and versatile model that is expected to remain an important component of the modern technology industry. It is important to understand the product description and design requirements, as well as actual case studies and precautions, in order to ensure that the chip model is compatible with the application environment. With the right knowledge and understanding, the XC3190-3PG175C chip model can be used to improve data transfer speeds, reduce latency, and improve overall performance in a variety of applications.
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2,523 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $20.0260 | $20.0260 |
| 10+ | $19.8106 | $198.1064 |
| 100+ | $18.7340 | $1,873.3971 |
| 1000+ | $17.6573 | $8,828.6530 |
| 10000+ | $16.1500 | $16,149.9750 |
| The price is for reference only, please refer to the actual quotation! | ||