XC3164A-4PG132C
XC3164A-4PG132C
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rohs

AMD Xilinx

XC3164A-4PG132C


XC3164A-4PG132C
F20-XC3164A-4PG132C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PGA, PGA132,14X14
PGA, PGA132,14X14

XC3164A-4PG132C ECAD Model


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XC3164A-4PG132C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 110
Number of Outputs 110
Number of Logic Cells 224
Number of Equivalent Gates 3500
Number of CLBs 224
Combinatorial Delay of a CLB-Max 3.3 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 224 CLBS, 3500 GATES
Additional Feature TYP. GATES = 3500-4500
Clock Frequency-Max 227 MHz
Power Supplies 5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-CPGA-P132
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Number of Terminals 132
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code PGA
Package Equivalence Code PGA132,14X14
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount NO
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 37.084 mm
Length 37.084 mm
Seated Height-Max 4.318 mm
Ihs Manufacturer XILINX INC
Part Package Code PGA
Package Description PGA, PGA132,14X14
Pin Count 132
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC3164A-4PG132C Datasheet Download


XC3164A-4PG132C Overview



The XC3164A-4PG132C chip model is a high-performance integrated circuit that was designed with the intention of providing advanced communication systems with reliable and efficient performance. It is a low-power, high-speed device that can be used in various networks and communication systems, and its features make it suitable for intelligent applications.


The XC3164A-4PG132C chip model is designed to provide a low-power and high-speed solution for communication systems. The chip model is composed of a 32-bit processor core, a memory system, a programmable logic array, and a programmable interconnect. The processor core is capable of executing instructions at up to 400 MHz, and the memory system contains up to 4GB of RAM. The programmable logic array and the programmable interconnect allow for the integration of custom logic into the chip model.


The XC3164A-4PG132C chip model is capable of supporting a wide range of communication protocols, such as Ethernet, Wi-Fi, Bluetooth, and Zigbee. It is also capable of supporting various intelligent scenarios, such as smart home, industrial automation, and IoT applications. The chip model also has the ability to be upgraded in the future, allowing it to keep up with the ever-evolving communication technologies.


The design requirements of the XC3164A-4PG132C chip model are quite specific. The chip model must be able to operate at temperatures between -40°C and 85°C, and it must be able to withstand a maximum voltage of 3.3V. The chip model is also designed to be compatible with various communication protocols, and it must be able to support a wide range of data rates.


Case studies have been conducted to evaluate the performance of the XC3164A-4PG132C chip model. The results of these studies have shown that the chip model is capable of providing reliable and efficient performance in communication systems. However, it is important to note that the chip model must be properly configured and maintained in order to ensure optimal performance.


In conclusion, the XC3164A-4PG132C chip model is an advanced integrated circuit that was designed with the intention of providing communication systems with reliable and efficient performance. It is capable of supporting a wide range of communication protocols and intelligent scenarios, and it can be upgraded in the future to keep up with the ever-evolving communication technologies. The design requirements of the chip model are quite specific, and it is important to ensure that it is properly configured and maintained in order to ensure optimal performance.



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