
AMD Xilinx
XC3164A-3PQG160I
XC3164A-3PQG160I ECAD Model
XC3164A-3PQG160I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 3500 | |
Number of CLBs | 224 | |
Combinatorial Delay of a CLB-Max | 2.7 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 224 CLBS, 3500 GATES | |
Additional Feature | MAX USABLE 4500 LOGIC GATES | |
Clock Frequency-Max | 270 MHz | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PQFP-G160 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 160 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP, | |
Pin Count | 160 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC3164A-3PQG160I Datasheet Download
XC3164A-3PQG160I Overview
The XC3164A-3PQG160I chip model is a high-performance, low-power, low-cost FPGA solution designed to meet the needs of a wide range of applications. It is a highly integrated device with a range of features and capabilities, including high-speed transceivers, high-speed I/O, and high-speed memory controllers. The XC3164A-3PQG160I is designed to provide a flexible, cost-effective solution for a variety of applications.
The original design intention of the XC3164A-3PQG160I was to provide a low-cost, low-power solution for a variety of applications. The design includes high-speed transceivers, high-speed I/O and high-speed memory controllers, allowing for a wide range of applications. The design also includes a range of features and capabilities, such as support for multiple protocols, support for advanced communication systems, and the ability to be used in the era of fully intelligent systems.
The XC3164A-3PQG160I is an ideal solution for a variety of applications, including communications networks, intelligent systems, and more. It is capable of supporting multiple protocols, such as Ethernet, Wi-Fi, and Bluetooth, and is well suited for use in advanced communication systems. The chip model can also be used in the era of fully intelligent systems, as it is capable of supporting the latest technologies, such as machine learning and artificial intelligence.
The product description of the XC3164A-3PQG160I includes a number of features and capabilities, such as a low-power, low-cost FPGA solution, high-speed transceivers, high-speed I/O and high-speed memory controllers, and support for multiple protocols, such as Ethernet, Wi-Fi and Bluetooth. In addition, the chip model is designed to be used in the era of fully intelligent systems, as it is capable of supporting the latest technologies, such as machine learning and artificial intelligence.
When using the XC3164A-3PQG160I, it is important to consider the specific design requirements of the application, as well as any potential upgrades that may be necessary. It is also important to consider the actual case studies in which the chip model has been used, as this can provide valuable insight into the performance of the chip model. Finally, it is important to consider any potential precautions when using the chip model, such as ensuring that the design is properly implemented and that the chip model is suitable for the intended application.
In conclusion, the XC3164A-3PQG160I is a high-performance, low-power, low-cost FPGA solution designed to meet the needs of a wide range of applications. It is capable of supporting multiple protocols, such as Ethernet, Wi-Fi and Bluetooth, and is well suited for use in advanced communication systems. The chip model can also be used in the era of fully intelligent systems, as it is capable of supporting the latest technologies, such as machine learning and artificial intelligence. When using the XC3164A-3PQG160I, it is important to consider the specific design requirements of the application, as well as any potential upgrades that may be necessary.
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