AMD Xilinx
XC3164A-3PC84I
XC3164A-3PC84I ECAD Model
XC3164A-3PC84I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 70 | |
| Number of Outputs | 70 | |
| Number of Logic Cells | 224 | |
| Number of Equivalent Gates | 3500 | |
| Number of CLBs | 224 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 224 CLBS, 3500 GATES | |
| Additional Feature | MAX USABLE 4500 LOGIC GATES | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | QCCJ, LDCC84,1.2SQ | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | LCC | |
| Pin Count | 84 |
XC3164A-3PC84I Datasheet Download
XC3164A-3PC84I Overview
The XC3164A-3PC84I chip model is an advanced semiconductor device that is widely used in the field of embedded systems. It is designed to meet the requirements of high-performance embedded systems, providing users with high-speed data transmission, low power consumption, and reliable performance. The chip model has been widely used in a variety of applications, including automotive, industrial, and medical.
In recent years, the chip model has seen a surge in popularity due to its ability to support new technologies. This includes the development of wireless networks, network security, and the Internet of Things (IoT). The chip model can also be used in the development and popularization of future intelligent robots, allowing for the integration of advanced technologies such as artificial intelligence, machine learning, and natural language processing.
The chip model is also suitable for the development of intelligent scenarios, such as smart homes and smart cities. It can be used to control and monitor a variety of devices, including lighting, security, and air conditioning systems. The chip model is also capable of supporting the development of fully intelligent systems, allowing for the integration of multiple sensors and devices.
In order to effectively use the chip model, technical talents are needed who have a deep understanding of the underlying technologies and their applications. This includes expertise in embedded systems, programming languages, and networking. Furthermore, knowledge of artificial intelligence, machine learning, and natural language processing is also essential.
Overall, the XC3164A-3PC84I chip model is a powerful and reliable device that has the potential to revolutionize the way we interact with technology. It can be used to support the development of new technologies, as well as intelligent scenarios and fully intelligent systems. With the right technical talents, the chip model can be used to create a new generation of intelligent robots and systems.
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1,310 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $17.2608 | $17.2608 |
| 10+ | $17.0752 | $170.7520 |
| 100+ | $16.1472 | $1,614.7200 |
| 1000+ | $15.2192 | $7,609.6000 |
| 10000+ | $13.9200 | $13,920.0000 |
| The price is for reference only, please refer to the actual quotation! | ||