XC3164A-2PQG160I
XC3164A-2PQG160I
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rohs

AMD Xilinx

XC3164A-2PQG160I


XC3164A-2PQG160I
F20-XC3164A-2PQG160I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, QFP
QFP

XC3164A-2PQG160I ECAD Model


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XC3164A-2PQG160I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Equivalent Gates 3500
Number of CLBs 224
Combinatorial Delay of a CLB-Max 2.2 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 224 CLBS, 3500 GATES
Additional Feature MAX USABLE 4500 LOGIC GATES
Clock Frequency-Max 323 MHz
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
JESD-30 Code S-PQFP-G160
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 160
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Shape SQUARE
Package Style FLATPACK
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 650 µm
Terminal Position QUAD
Width 28 mm
Length 28 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description QFP,
Pin Count 160
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC3164A-2PQG160I Datasheet Download


XC3164A-2PQG160I Overview



The XC3164A-2PQG160I chip model is an advanced semiconductor device with robust performance and wide application scenarios. It is designed to be used in high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is also suitable for networks and intelligent scenarios, providing a high-performance, low-power solution for the era of fully intelligent systems.


This chip model is equipped with a variety of features and functions, including a wide range of memory options, a high-speed, low-power 32-bit processor core, high-performance DSP blocks, and a comprehensive set of peripherals. It also supports multiple bus interfaces, including Ethernet, USB, and PCI Express. This makes it suitable for a variety of applications, from high-performance embedded systems to high-end multimedia applications.


The XC3164A-2PQG160I chip model also provides a comprehensive set of design tools and reference designs to help users get started quickly. The design tools include FPGA design software, HDL design tools, and debugging tools. The reference designs provide complete examples of how to use the chip model in various applications.


When designing with the XC3164A-2PQG160I chip model, it is important to consider the specific requirements of the application. For example, the memory and processor core should be configured to meet the needs of the application. The number of peripherals and the type of bus interface should also be determined. Additionally, the power requirements of the chip model should be taken into consideration.


In order to ensure successful implementation of the XC3164A-2PQG160I chip model, there are a few precautions that should be taken. First, the design should be thoroughly tested and verified before deployment. Second, the chip model should be properly cooled to ensure optimal performance. Finally, the chip model should be used in accordance with the manufacturer's instructions.


The XC3164A-2PQG160I chip model is a powerful and versatile semiconductor device that is suitable for a wide range of applications. It is designed to meet the needs of high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is also suitable for networks and intelligent scenarios, providing a high-performance, low-power solution for the era of fully intelligent systems. With its comprehensive set of features and design tools, the XC3164A-2PQG160I chip model is an ideal choice for any application.



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