AMD Xilinx
XC3164A-2PQ160C
XC3164A-2PQ160C ECAD Model
XC3164A-2PQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 120 | |
| Number of Outputs | 120 | |
| Number of Logic Cells | 224 | |
| Number of Equivalent Gates | 3500 | |
| Number of CLBs | 224 | |
| Combinatorial Delay of a CLB-Max | 2.2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 224 CLBS, 3500 GATES | |
| Additional Feature | MAX USABLE 4500 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP160,1.2SQ | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3164A-2PQ160C Datasheet Download
XC3164A-2PQ160C Overview
The Xilinx XC3164A-2PQ160C chip model is a powerful and versatile programmable logic device that can be used in a variety of applications. It is a field-programmable gate array (FPGA) that can be used to implement a range of digital systems, including communication systems, data processing systems, and embedded systems. The XC3164A-2PQ160C chip model has been designed to be highly efficient and cost-effective, making it a great choice for many applications.
The XC3164A-2PQ160C chip model is based on an advanced Xilinx architecture, providing a wide range of features and capabilities. The chip model includes several features that make it suitable for a variety of applications, including high-speed signal processing, low power consumption, and high-density integration. The XC3164A-2PQ160C chip model also offers low-cost and high-performance solutions for a variety of applications.
Regarding the industry trends of the XC3164A-2PQ160C chip model and the future development of related industries, it is important to consider what specific technologies are needed. The chip model is designed to provide an efficient and cost-effective solution to many applications, but it may require additional technologies in order to meet the specific requirements of certain applications. In some cases, new technologies may be needed in order to take advantage of the capabilities of the XC3164A-2PQ160C chip model.
The original design intention of the XC3164A-2PQ160C chip model was to provide a high-performance, cost-effective solution for a wide range of applications. The chip model is designed to be highly efficient, with low power consumption and high-density integration. In addition, the XC3164A-2PQ160C chip model can be upgraded to meet the needs of more advanced applications. The chip model is also designed to be compatible with a wide range of communication systems, making it suitable for many applications.
In order to understand the product description and specific design requirements of the XC3164A-2PQ160C chip model, it is important to consider the actual case studies and precautions. It is also important to consider the potential future upgrades that may be required in order to take advantage of the capabilities of the chip model. In addition, it is important to consider the potential applications and the specific technologies that may be needed in order to meet the requirements of those applications.
The XC3164A-2PQ160C chip model is a powerful and versatile programmable logic device that can be used in a variety of applications. It is designed to provide an efficient and cost-effective solution to many applications, but it may require additional technologies in order to meet the specific requirements of certain applications. In addition, it is important to consider the potential future upgrades that may be required in order to take advantage of the capabilities of the chip model, as well as the actual case studies and precautions that should be taken. By understanding the product description, design requirements, and potential applications, it is possible to determine whether the XC3164A-2PQ160C chip model is the right solution for a given application.
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