
AMD Xilinx
XC3164-3PQ160C
XC3164-3PQ160C ECAD Model
XC3164-3PQ160C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 120 | |
Number of Outputs | 120 | |
Number of Logic Cells | 224 | |
Number of Equivalent Gates | 4000 | |
Number of CLBs | 224 | |
Combinatorial Delay of a CLB-Max | 2.7 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 224 CLBS, 4000 GATES | |
Additional Feature | MAX. 120 I/OS; 688 FLIP-FLOPS; TYP. GATES = 4000 - 5500 | |
Clock Frequency-Max | 270 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G160 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 160 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Equivalence Code | QFP160,1.2SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 3.94 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP, QFP160,1.2SQ | |
Pin Count | 160 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC3164-3PQ160C Datasheet Download
XC3164-3PQ160C Overview
The XC3164-3PQ160C chip model is a cutting-edge technology developed by Xilinx, Inc. It has been designed to provide high-performance, low-cost, and low-power solutions for a wide range of applications. This chip model offers significant advantages over other chip models in terms of power consumption, cost, and performance.
In terms of power consumption, the XC3164-3PQ160C chip model is designed to provide a low-power solution for applications that require high performance. It utilizes a low-power design approach that reduces the power consumption of the chip by up to 50%. This makes it an ideal choice for applications that require high performance while consuming less power.
In terms of cost, the XC3164-3PQ160C chip model is designed to provide an economical solution for applications that require high performance. It utilizes an advanced manufacturing process that reduces the cost of the chip by up to 40%. This makes it an ideal choice for applications that require high performance while keeping the cost low.
In terms of performance, the XC3164-3PQ160C chip model is designed to provide high performance for applications that require low power consumption and low cost. It utilizes an advanced architecture that provides up to 10 times the performance of other chip models. This makes it an ideal choice for applications that require high performance while keeping the power consumption and cost low.
The XC3164-3PQ160C chip model is expected to be in high demand in the near future due to its advantages over other chip models. It is expected to be used in a wide range of applications such as consumer electronics, automotive, medical, and industrial applications. It is also expected to be used in more advanced communication systems due to its high performance and low power consumption.
The XC3164-3PQ160C chip model is also expected to be used in the development and popularization of future intelligent robots. It is designed to provide a low-cost, low-power solution for the development of robots that require high performance. It is also designed to provide an efficient platform for the development of robots that require complex tasks to be performed.
In order to use the XC3164-3PQ160C chip model effectively, it is necessary to have a good understanding of the chip's architecture and its capabilities. This requires technical knowledge in the areas of computer engineering, electrical engineering, and embedded systems. It is also necessary to have a good understanding of the design process and the tools used in the development of the chip. In addition, it is important to have a good understanding of the software and hardware that can be used to program the chip.
The XC3164-3PQ160C chip model is a cutting-edge technology that offers significant advantages over other chip models. It is expected to be in high demand in the near future due to its low power consumption, cost, and performance. It is also expected to be used in the development and popularization of future intelligent robots due to its low-cost, low-power solution. In order to use the chip model effectively, it is necessary to have a good understanding of the chip's architecture, design process, and the tools used in the development of the chip.
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4,227 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $19.6728 | $19.6728 |
10+ | $19.4613 | $194.6131 |
100+ | $18.4036 | $1,840.3632 |
1000+ | $17.3460 | $8,672.9760 |
10000+ | $15.8652 | $15,865.2000 |
The price is for reference only, please refer to the actual quotation! |