
AMD Xilinx
XC3142A-4PQG100C
XC3142A-4PQG100C ECAD Model
XC3142A-4PQG100C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 2000 | |
Number of CLBs | 144 | |
Combinatorial Delay of a CLB-Max | 3.3 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | RECTANGULAR | |
Technology | CMOS | |
Organization | 144 CLBS, 2000 GATES | |
Additional Feature | MAX USABLE 3000 LOGIC GATES | |
Clock Frequency-Max | 227 MHz | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | R-PQFP-G100 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 20 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP, | |
Pin Count | 100 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC3142A-4PQG100C Datasheet Download
XC3142A-4PQG100C Overview
The Xilinx XC3142A-4PQG100C chip model is a powerful and innovative solution for modern communication systems. It is designed to provide robust and reliable performance for a wide range of applications and scenarios. This chip model is a great example of how modern technology can be used to create reliable and efficient communication systems.
The XC3142A-4PQG100C chip model has a number of advantages that make it an ideal choice for communication systems. Firstly, the chip model has a low power consumption, which is beneficial for both energy efficiency and cost savings. It also has a high speed and low latency, which makes it suitable for a wide range of applications and scenarios. Furthermore, the chip is designed to be highly reliable and robust, making it suitable for long-term use in communication systems.
In addition, the XC3142A-4PQG100C chip model is designed to be highly upgradable, allowing for future upgrades and improvements. This makes it an ideal choice for communication systems that need to be able to keep up with changing technology and demands. Furthermore, the chip model is designed to be compatible with a wide range of communication systems, making it suitable for a variety of applications.
The XC3142A-4PQG100C chip model is expected to be in high demand in the future, as it is suitable for a wide range of applications and scenarios. It is likely to be used in a variety of networks and communication systems, such as 5G, IoT, and AI systems. Furthermore, it is also likely to be used in advanced communication systems, such as autonomous vehicles and smart homes.
The XC3142A-4PQG100C chip model is also likely to be used in the era of fully intelligent systems. This chip model is designed to be highly reliable and robust, making it suitable for use in intelligent systems. Furthermore, it is designed to be highly upgradable, allowing for future upgrades and improvements. This makes it an ideal choice for intelligent systems that need to keep up with changing technology and demands.
In conclusion, the Xilinx XC3142A-4PQG100C chip model is an innovative and powerful solution for modern communication systems. It has a number of advantages that make it an ideal choice for a wide range of applications and scenarios. Furthermore, it is designed to be highly upgradable and compatible with a wide range of communication systems, making it suitable for use in the era of fully intelligent systems. As a result, the XC3142A-4PQG100C chip model is expected to be in high demand in the future.
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