XC3142A-4PQG100C
XC3142A-4PQG100C
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rohs

AMD Xilinx

XC3142A-4PQG100C


XC3142A-4PQG100C
F20-XC3142A-4PQG100C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, QFP
QFP

XC3142A-4PQG100C ECAD Model


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XC3142A-4PQG100C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Equivalent Gates 2000
Number of CLBs 144
Combinatorial Delay of a CLB-Max 3.3 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape RECTANGULAR
Technology CMOS
Organization 144 CLBS, 2000 GATES
Additional Feature MAX USABLE 3000 LOGIC GATES
Clock Frequency-Max 227 MHz
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code R-PQFP-G100
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Shape RECTANGULAR
Package Style FLATPACK
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 650 µm
Terminal Position QUAD
Width 14 mm
Length 20 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description QFP,
Pin Count 100
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC3142A-4PQG100C Datasheet Download


XC3142A-4PQG100C Overview



The Xilinx XC3142A-4PQG100C chip model is a powerful and innovative solution for modern communication systems. It is designed to provide robust and reliable performance for a wide range of applications and scenarios. This chip model is a great example of how modern technology can be used to create reliable and efficient communication systems.


The XC3142A-4PQG100C chip model has a number of advantages that make it an ideal choice for communication systems. Firstly, the chip model has a low power consumption, which is beneficial for both energy efficiency and cost savings. It also has a high speed and low latency, which makes it suitable for a wide range of applications and scenarios. Furthermore, the chip is designed to be highly reliable and robust, making it suitable for long-term use in communication systems.


In addition, the XC3142A-4PQG100C chip model is designed to be highly upgradable, allowing for future upgrades and improvements. This makes it an ideal choice for communication systems that need to be able to keep up with changing technology and demands. Furthermore, the chip model is designed to be compatible with a wide range of communication systems, making it suitable for a variety of applications.


The XC3142A-4PQG100C chip model is expected to be in high demand in the future, as it is suitable for a wide range of applications and scenarios. It is likely to be used in a variety of networks and communication systems, such as 5G, IoT, and AI systems. Furthermore, it is also likely to be used in advanced communication systems, such as autonomous vehicles and smart homes.


The XC3142A-4PQG100C chip model is also likely to be used in the era of fully intelligent systems. This chip model is designed to be highly reliable and robust, making it suitable for use in intelligent systems. Furthermore, it is designed to be highly upgradable, allowing for future upgrades and improvements. This makes it an ideal choice for intelligent systems that need to keep up with changing technology and demands.


In conclusion, the Xilinx XC3142A-4PQG100C chip model is an innovative and powerful solution for modern communication systems. It has a number of advantages that make it an ideal choice for a wide range of applications and scenarios. Furthermore, it is designed to be highly upgradable and compatible with a wide range of communication systems, making it suitable for use in the era of fully intelligent systems. As a result, the XC3142A-4PQG100C chip model is expected to be in high demand in the future.



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