AMD Xilinx
XC3142A-4PQ100I
XC3142A-4PQ100I ECAD Model
XC3142A-4PQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 82 | |
| Number of Outputs | 82 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 3.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 144 CLBS, 2000 GATES | |
| Additional Feature | MAX USABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3142A-4PQ100I Datasheet Download
XC3142A-4PQ100I Overview
The XC3142A-4PQ100I chip model is a cutting-edge technology developed by a leading semiconductor manufacturer. It is designed to provide high performance and superior power efficiency for a wide range of applications. The chip model is based on a 32-bit RISC processor with a high-speed, low-power core and integrated peripherals, making it an ideal choice for applications requiring low power consumption and high performance.
The XC3142A-4PQ100I chip model offers a number of advantages over traditional chip models. It is designed to support a wide range of operating systems and programming languages, making it an ideal choice for applications requiring high performance and low power consumption. It also has a high level of integration, offering users the ability to quickly and easily develop applications with a minimum of hardware components.
The XC3142A-4PQ100I chip model has been widely used in a variety of industries, such as automotive, consumer electronics, and medical devices. Its superior performance and power efficiency make it an ideal choice for applications requiring high performance and low power consumption. In addition, its high level of integration allows users to quickly and easily develop applications with a minimum of hardware components.
The demand for the XC3142A-4PQ100I chip model is expected to increase in the future as more applications require the support of new technologies. For example, the automotive industry is expected to experience a rapid increase in the demand for the chip model as more vehicles are equipped with advanced driver assistance systems. Similarly, consumer electronics and medical devices are expected to experience a surge in demand as more devices are designed to support the latest technologies.
When designing applications using the XC3142A-4PQ100I chip model, it is important to consider the specific requirements of the application. This includes the power consumption, performance, and the operating system and programming language compatibility. In addition, it is important to consider the actual environment in which the application will be used, as different environments may require different technologies.
In conclusion, the XC3142A-4PQ100I chip model is an advanced technology developed by a leading semiconductor manufacturer. It offers superior performance and power efficiency for a wide range of applications and is expected to experience an increase in demand in the future. When designing applications using the chip model, it is important to consider the specific requirements of the application and the actual environment in which it will be used.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||