AMD Xilinx
XC3142A-3PQ100I
XC3142A-3PQ100I ECAD Model
XC3142A-3PQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 82 | |
| Number of Outputs | 82 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 144 CLBS, 2000 GATES | |
| Additional Feature | MAX USABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3142A-3PQ100I Datasheet Download
XC3142A-3PQ100I Overview
The XC3142A-3PQ100I chip model is a powerful and versatile solution for a variety of applications. It is designed to provide high performance, low power consumption, and scalability. It is suitable for a wide range of applications, from consumer electronics to industrial automation.
The XC3142A-3PQ100I chip model is based on the latest technologies, such as artificial intelligence and machine learning. It is designed to be able to handle a variety of tasks, from basic data processing to more complex tasks such as natural language processing. It also has a wide range of features, including high speed data transfer, low power consumption, and scalability.
The XC3142A-3PQ100I chip model is designed to be future-proof. It is designed with the intention of being upgradeable to support new technologies and applications as they become available. This means that the chip model can be used in a wide range of applications, from basic communication systems to more advanced networks. It can also be used in the era of fully intelligent systems, where it can be used to provide intelligent solutions for a variety of scenarios.
The XC3142A-3PQ100I chip model is also designed to be compatible with a variety of networks. It is capable of supporting both wired and wireless networks, as well as a variety of protocols. This makes it suitable for a variety of applications, from home networks to large-scale enterprise networks. It can also be used in intelligent scenarios, such as smart home systems and autonomous vehicles.
In conclusion, the XC3142A-3PQ100I chip model is a powerful and versatile solution for a variety of applications. It is designed to be future-proof, able to support new technologies and applications as they become available. It is also designed to be compatible with a variety of networks, making it suitable for a wide range of applications. Finally, it can be used in intelligent scenarios, such as smart home systems and autonomous vehicles, making it a great choice for the future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||