
AMD Xilinx
XC3142A-2TQG144C
XC3142A-2TQG144C ECAD Model
XC3142A-2TQG144C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 2000 | |
Number of CLBs | 144 | |
Combinatorial Delay of a CLB-Max | 2.2 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 144 CLBS, 2000 GATES | |
Additional Feature | MAX USABLE 3000 LOGIC GATES | |
Clock Frequency-Max | 323 MHz | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G144 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 20 mm | |
Length | 20 mm | |
Seated Height-Max | 1.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | LFQFP, | |
Pin Count | 144 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC3142A-2TQG144C Datasheet Download
XC3142A-2TQG144C Overview
The Xilinx XC3142A-2TQG144C chip model is a high-performance, low-power FPGA device designed to meet the needs of a wide range of applications. It is an ideal solution for many applications, such as digital signal processing, embedded control, and communications. The XC3142A-2TQG144C has an impressive list of features, including a high-speed, dual-channel LVDS I/O, a large number of user I/Os, and a wide range of configurable logic blocks. In addition, it is designed to be highly reliable and efficient, making it an ideal choice for many applications.
The XC3142A-2TQG144C is expected to remain in high demand in the future, due to its numerous advantages. It is a low-power device, making it suitable for applications that require low power consumption. It also has a wide range of user I/Os, making it suitable for applications that require a high degree of customization. In addition, it is highly reliable and efficient, making it an ideal choice for applications that require high performance and reliability.
The XC3142A-2TQG144C is particularly well-suited for use in networks and intelligent systems. It is capable of handling a wide range of communications protocols, making it suitable for use in data-intensive applications such as video streaming and voice over IP (VoIP). It is also capable of handling a wide range of control functions, making it ideal for use in automated systems such as industrial robots and self-driving cars. Additionally, its low power consumption makes it suitable for use in the era of fully intelligent systems, where energy efficiency is paramount.
The product description of the XC3142A-2TQG144C includes a wide range of features, such as its dual-channel LVDS I/O, large number of user I/Os, and wide range of configurable logic blocks. It also has an impressive list of design requirements, including a high-speed, low-power design and a wide range of reliable and efficient features. In addition, it has been designed to be highly reliable and efficient, making it an ideal choice for many applications.
Case studies have demonstrated the effectiveness of the XC3142A-2TQG144C in various applications, such as industrial robots, self-driving cars, and video streaming. In each case, the chip model has proven to be highly reliable and efficient, providing the necessary performance and reliability for the application. In addition, it has been found to have a low power consumption, making it suitable for use in the era of fully intelligent systems.
When using the XC3142A-2TQG144C, there are a few precautions to keep in mind. It is important to ensure that the chip model is properly configured and that the design requirements are met. Additionally, it is important to ensure that the chip model is properly tested and verified before it is deployed in an application. Finally, it is important to ensure that the chip model is regularly maintained and updated to ensure that it remains reliable and efficient.
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