AMD Xilinx
XC3142A-2TQ144C
XC3142A-2TQ144C ECAD Model
XC3142A-2TQ144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 96 | |
| Number of Outputs | 96 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 2.2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 144 CLBS, 2000 GATES | |
| Additional Feature | MAX USABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP144,.87SQ,20 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3142A-2TQ144C Datasheet Download
XC3142A-2TQ144C Overview
The chip model XC3142A-2TQ144C is a highly advanced semiconductor device that is being used in a wide range of applications. It is a 32-bit XC3142A-2TQ144C microcontroller with a wide range of features and functions. It is designed to help reduce the complexity of embedded system designs and provide better performance and scalability.
The XC3142A-2TQ144C chip model is an application-specific integrated circuit (ASIC) that is used in various industries such as automotive, consumer electronics, medical, industrial, and home appliances. Its features include low power consumption, high speed, and low cost. It is also designed to be compatible with a wide range of operating systems and development tools.
In terms of industry trends, the XC3142A-2TQ144C chip model is expected to become increasingly popular in the near future. Its low power consumption and high speed make it a great choice for applications that require high performance and low energy consumption. Additionally, its scalability means that it can be used in a variety of applications and can be easily integrated into existing systems.
The XC3142A-2TQ144C chip model can also be used in the development and popularization of future intelligent robots. Its high speed and low power consumption make it an ideal choice for robots that need to process large amounts of data quickly and accurately. Additionally, its scalability and compatibility with a wide range of operating systems and development tools make it an excellent choice for robot applications.
In order to use the XC3142A-2TQ144C chip model effectively, technical talents such as software engineers, hardware engineers, and system architects are needed. Software engineers are needed to develop the software that will be used to control the robots and to optimize the performance of the chip. Hardware engineers will be needed to design and implement the hardware components of the robot, as well as to ensure that the chip is properly integrated into the robot. Finally, system architects will be needed to ensure that the robot is able to interact with its environment in a safe and efficient manner.
In conclusion, the XC3142A-2TQ144C chip model is a highly advanced semiconductor device that is being used in a wide range of applications. Its features, including low power consumption, high speed, and scalability, make it an excellent choice for a variety of applications. It is also expected to become increasingly popular in the near future, and can be used in the development and popularization of future intelligent robots. To use the chip model effectively, technical talents such as software engineers, hardware engineers, and system architects are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||