AMD Xilinx
XC3142A-1VQ100C
XC3142A-1VQ100C ECAD Model
XC3142A-1VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 82 | |
| Number of Outputs | 82 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 1.75 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 144 CLBS, 2000 GATES | |
| Additional Feature | MAX USABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant |
XC3142A-1VQ100C Datasheet Download
XC3142A-1VQ100C Overview
The XC3142A-1VQ100C chip model is a new and innovative integrated circuit that has been developed to meet the demands of the modern technological landscape. This chip model is capable of providing high-performance, low-power solutions that make it ideal for a variety of applications. It is designed to be used in a wide range of communication systems, including both wired and wireless networks.
The XC3142A-1VQ100C chip model is designed to provide a high level of performance and efficiency. It is equipped with a variety of features that make it suitable for a variety of applications. It is capable of providing high-speed data transfer, low-power operation, and improved signal integrity. It is also designed to be highly reliable and durable, making it an ideal choice for long-term use.
The XC3142A-1VQ100C chip model is designed to be scalable and can be upgraded to meet the demands of future applications. It is capable of being used in advanced communication systems, such as 5G networks and beyond. It is also capable of being used in networks that are designed for intelligent applications, such as machine learning and artificial intelligence. This makes it an ideal choice for the era of fully intelligent systems.
The XC3142A-1VQ100C chip model is expected to be in high demand in the future, as it is designed to be a powerful and efficient solution for a variety of applications. It is capable of providing a high level of performance and reliability, making it an ideal choice for a variety of applications. As the demand for advanced communication systems and intelligent applications continues to grow, the XC3142A-1VQ100C chip model is expected to be a popular choice for many industries.
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5,938 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $19.3440 | $19.3440 |
| 10+ | $19.1360 | $191.3600 |
| 100+ | $18.0960 | $1,809.6000 |
| 1000+ | $17.0560 | $8,528.0000 |
| 10000+ | $15.6000 | $15,600.0000 |
| The price is for reference only, please refer to the actual quotation! | ||