AMD Xilinx
XC3142A-1PQG100C
XC3142A-1PQG100C ECAD Model
XC3142A-1PQG100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 1.75 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 144 CLBS, 2000 GATES | |
| Additional Feature | MAX USABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC3142A-1PQG100C Datasheet Download
XC3142A-1PQG100C Overview
The chip model XC3142A-1PQG100C is a highly advanced integrated circuit designed by Xilinx, Inc. It is a high-performance, low-power, low-cost FPGA (Field Programmable Gate Array) solution. It is a single-chip solution that combines the power of an FPGA with the flexibility and scalability of a microcontroller. This chip model is designed for a wide range of applications, including industrial automation, automotive, medical, aerospace, and communication systems.
The XC3142A-1PQG100C chip model is designed to meet the needs of today’s sophisticated and demanding applications. It provides a high-performance, low-power, low-cost solution for a wide range of applications. It is equipped with a wide range of features, including advanced logic, high-speed memory, high-speed I/O, and a wide range of peripherals. It is also designed to be compatible with the latest technologies, such as Ethernet, USB, and PCI Express.
The XC3142A-1PQG100C chip model is designed to be highly reliable and flexible. It can be used in a wide range of applications, including industrial automation, automotive, medical, aerospace, and communication systems. It can also be used in a wide range of intelligent scenarios, such as robotics, machine learning, and artificial intelligence. It is also designed to be highly scalable, allowing for future upgrades and expansion.
The XC3142A-1PQG100C chip model is designed to be highly reliable and flexible, and can be used in a wide range of applications. It is also designed to be compatible with the latest technologies, such as Ethernet, USB, and PCI Express. This chip model is designed for a wide range of applications, including industrial automation, automotive, medical, aerospace, and communication systems. It is also designed to be highly scalable, allowing for future upgrades and expansion.
The XC3142A-1PQG100C chip model is designed to be highly reliable and flexible, and can be used in a wide range of applications. It is also designed to be compatible with the latest technologies, such as Ethernet, USB, and PCI Express. Its potential applications in networks and intelligent scenarios are numerous, and it is capable of being used in the era of fully intelligent systems. Furthermore, its original design intention and the possibility of future upgrades make it suitable for advanced communication systems.
In conclusion, the XC3142A-1PQG100C chip model is a highly advanced integrated circuit designed by Xilinx, Inc. It is a high-performance, low-power, low-cost FPGA solution that is capable of being used in a wide range of applications, including industrial automation, automotive, medical, aerospace, and communication systems. It is also designed to be compatible with the latest technologies, such as Ethernet, USB, and PCI Express. Its potential applications in networks and intelligent scenarios are numerous, and it is capable of being used in the era of fully intelligent systems. Furthermore, its original design intention and the possibility of future upgrades make it suitable for advanced communication systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
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