AMD Xilinx
XC3142A-1PQ100C
XC3142A-1PQ100C ECAD Model
XC3142A-1PQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 82 | |
| Number of Outputs | 82 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 1.75 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 144 CLBS, 2000 GATES | |
| Additional Feature | MAX USABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant |
XC3142A-1PQ100C Datasheet Download
XC3142A-1PQ100C Overview
The XC3142A-1PQ100C is an advanced chip model that is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a hardware description language used to design and document digital systems.
The XC3142A-1PQ100C is a high-performance chip model that is designed to meet the needs of the most demanding applications. It has a wide range of features, such as high-speed data processing, low power consumption, and a small form factor. It is also designed to be compatible with a variety of development tools, such as FPGA and ASIC.
In terms of industry trends, the XC3142A-1PQ100C chip model is set to become increasingly popular in the future. This is due to the fact that the chip model has the potential to revolutionize the way we use digital systems. It is also capable of handling complex tasks, such as image processing and embedded processing.
As for the product description and specific design requirements of the XC3142A-1PQ100C chip model, it is important to note that the chip model is designed to be used in a variety of development tools. In order to use the chip model, the user must have a good understanding of HDL language, as well as the various development tools available.
It is also important to note that the XC3142A-1PQ100C chip model is designed to be used in a variety of application environments. Depending on the application environment, the user may need to use new technologies, such as FPGA or ASIC, in order to make use of the chip model.
Finally, it is important to note that the XC3142A-1PQ100C chip model is designed to be used in a variety of application environments. In order to get the most out of the chip model, it is important to take into account actual case studies and precautions. This includes understanding the various development tools available, as well as the various application environments in which the chip model can be used.
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