AMD Xilinx
XC3142-5PQ100I
XC3142-5PQ100I ECAD Model
XC3142-5PQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 82 | |
| Number of Outputs | 82 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 3000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 4.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 144 CLBS, 3000 GATES | |
| Additional Feature | MAX. 96 I/OS; 480 FLIP-FLOPS; TYP. GATES = 3000 - 3700 | |
| Clock Frequency-Max | 190 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 2.87 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | QFP, QFP100,.7X.9 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Pin Count | 100 |
XC3142-5PQ100I Datasheet Download
XC3142-5PQ100I Overview
The chip model XC3142-5PQ100I is a cutting-edge technology developed by Xilinx Inc. It is a field-programmable gate array (FPGA) that integrates high-speed transceivers, block RAM, and digital signal processing (DSP) resources. This chip model is designed to meet the needs of a variety of applications, including networking, communications, and industrial control.
In terms of industry trends, the XC3142-5PQ100I chip model is expected to be widely adopted in the near future due to its high performance and low cost. It can provide reliable and high-speed data transmission, as well as support for various advanced applications. For example, it can be used in data centers, 5G networks, and other next-generation communication networks. In addition, the chip model is also suitable for industrial automation and control, providing advanced features such as real-time computing and data processing.
In terms of future applications, XC3142-5PQ100I is expected to be used in a variety of intelligent scenarios. For example, it can be used in the Internet of Things (IoT) to provide reliable data transmission and control. It can also be used in autonomous vehicles, providing high-speed data processing and real-time control. In the era of fully intelligent systems, XC3142-5PQ100I can be used to support a variety of intelligent applications, such as artificial intelligence (AI) and machine learning (ML).
In conclusion, XC3142-5PQ100I is a cutting-edge chip model developed by Xilinx Inc. It is expected to be widely adopted in the near future due to its high performance and low cost. It can provide reliable and high-speed data transmission, as well as support for various advanced applications. In the future, it is expected to be used in a variety of intelligent scenarios, such as the Internet of Things (IoT), autonomous vehicles, and fully intelligent systems.
You May Also Be Interested In
3,647 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||