AMD Xilinx
XC3142-4PC84C
XC3142-4PC84C ECAD Model
XC3142-4PC84C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 74 | |
| Number of Outputs | 74 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 3000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 3.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 144 CLBS, 3000 GATES | |
| Additional Feature | MAX. 96 I/OS; 480 FLIP-FLOPS; TYP. GATES = 3000 - 3700 | |
| Clock Frequency-Max | 230 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 4.699 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | PLASTIC, LCC-84 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3142-4PC84C Datasheet Download
XC3142-4PC84C Overview
The chip model XC3142-4PC84C is a leading product in the semiconductor industry, and its development has been a major focus of the industry in recent years. The chip model has been developed to meet the needs of the latest technologies, and its design is tailored to the specific requirements of the application environment.
The chip model XC3142-4PC84C is a highly specialized product that is designed to meet the needs of the most demanding applications. It is capable of operating in a wide range of networks, and it is also suitable for use in intelligent scenarios. The chip model is designed to be used in the era of fully intelligent systems, and it is capable of providing the necessary support for these systems.
The product description of the chip model XC3142-4PC84C is comprehensive, and it covers all the necessary aspects related to its design and development. The chip model is designed to meet the needs of the most demanding applications, and it is capable of operating in a wide range of networks. It is also designed to be used in the era of fully intelligent systems, and it is capable of providing the necessary support for these systems.
The design requirements of the chip model XC3142-4PC84C are tailored to the specific requirements of the application environment, and the chip model is capable of operating in a wide range of networks. The chip model is also suitable for use in intelligent scenarios, and it is capable of providing the necessary support for these systems.
Case studies have been conducted to assess the performance of the chip model XC3142-4PC84C, and these studies have shown that the chip model is capable of meeting the needs of the most demanding applications. The chip model is also suitable for use in intelligent scenarios, and it is capable of providing the necessary support for these systems.
The chip model XC3142-4PC84C is a highly specialized product, and it is important to take certain precautions when using it. The chip model should be used in accordance with the manufacturer’s instructions, and it should be installed and operated in a controlled environment. It is also important to ensure that the chip model is compatible with the specific application environment before using it.
In conclusion, the chip model XC3142-4PC84C is a leading product in the semiconductor industry, and its development has been a major focus of the industry in recent years. The chip model has been developed to meet the needs of the latest technologies, and its design is tailored to the specific requirements of the application environment. It is capable of operating in a wide range of networks, and it is also suitable for use in intelligent scenarios. The chip model is designed to be used in the era of fully intelligent systems, and it is capable of providing the necessary support for these systems. It is important to take certain precautions when using the chip model, and it is also important to ensure that the chip model is compatible with the specific application environment before using it.
You May Also Be Interested In
3,169 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||