AMD Xilinx
XC3142-3PC84C
XC3142-3PC84C ECAD Model
XC3142-3PC84C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 74 | |
| Number of Outputs | 74 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 3000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 144 CLBS, 3000 GATES | |
| Additional Feature | MAX. 96 I/OS; 480 FLIP-FLOPS; TYP. GATES = 3000 - 3700 | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 4.699 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | PLASTIC, LCC-84 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3142-3PC84C Datasheet Download
XC3142-3PC84C Overview
The XC3142-3PC84C chip model is a high-performance integrated circuit that is suitable for a wide range of applications, including digital signal processing, embedded processing, and image processing. It requires the use of HDL language for programming. This chip model has been widely adopted in the industry and is expected to continue to be a key component in the development of future technology.
The future applications of the XC3142-3PC84C chip model are expected to be wide-ranging. This chip model can be used in networks, providing a powerful tool for intelligent systems. It can be used to create intelligent systems that can process data quickly and accurately, allowing for more efficient operations. Additionally, the chip model can be used to enable intelligent scenarios, such as autonomous vehicles, smart home systems, and more.
The XC3142-3PC84C chip model is also expected to be used in the era of fully intelligent systems. This chip model can provide the necessary computing power and processing capabilities to enable intelligent systems to work effectively. It can be used to create intelligent systems that can make decisions based on data, allowing for more efficient operations. Additionally, the chip model can be used to enable intelligent scenarios, such as autonomous vehicles, smart home systems, and more.
Overall, the XC3142-3PC84C chip model is an important component in the development of future technology. It is expected to be used in a wide range of applications, from networks to intelligent systems. It is expected to provide the necessary computing power and processing capabilities to enable intelligent systems to work effectively, allowing for more efficient operations. Additionally, the chip model can be used to enable intelligent scenarios, such as autonomous vehicles, smart home systems, and more. This chip model is expected to continue to be a key component in the development of future technology.
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2,267 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $22.3200 | $22.3200 |
| 10+ | $22.0800 | $220.8000 |
| 100+ | $20.8800 | $2,088.0000 |
| 1000+ | $19.6800 | $9,840.0000 |
| 10000+ | $18.0000 | $18,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||