AMD Xilinx
XC3142-1VQ100C
XC3142-1VQ100C ECAD Model
XC3142-1VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 82 | |
| Number of Outputs | 82 | |
| Number of Logic Cells | 144 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 325 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3142-1VQ100C Datasheet Download
XC3142-1VQ100C Overview
The XC3142-1VQ100C chip model is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL (Hardware Description Language) programming language, allowing for efficient and flexible development of a wide range of applications.
The original design intention for the XC3142-1VQ100C was to provide a powerful, yet cost-effective solution for digital signal processing, embedded processing, and image processing. The chip model utilizes an array of advanced features such as a high-speed data bus, a large on-board memory, and a wide range of peripherals that are easily accessible through the HDL language. The chip model is also designed with the possibility of future upgrades in mind, allowing for the addition of new features and performance improvements.
The XC3142-1VQ100C chip model is a versatile and powerful solution for digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL programming language, allowing for the development of highly efficient and flexible applications. The chip model features an array of advanced features, such as a high-speed data bus, a large on-board memory, and a wide range of peripherals that are easily accessible through the HDL language.
The product description for the XC3142-1VQ100C includes detailed information about the chip model's features, such as its data bus speed, memory size, and peripheral capabilities. It also includes detailed design requirements for the chip model, such as the programming language that must be used, the power requirements, and the types of components that can be used with the chip model.
Case studies and precautions should also be taken into consideration when designing applications with the XC3142-1VQ100C chip model. Case studies can provide valuable insights into how the chip model can be used to develop efficient and flexible applications. Precautions should also be taken to ensure that the chip model is being used properly and that the application is designed to meet the chip model's design requirements.
In conclusion, the XC3142-1VQ100C chip model is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL programming language, allowing for the development of highly efficient and flexible applications. The product description for the chip model includes detailed information about the chip model's features, as well as design requirements and precautions that should be taken into consideration when designing applications with the chip model. The chip model is also designed with the possibility of future upgrades in mind, allowing for the addition of new features and performance improvements.
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