AMD Xilinx
XC3130A-4VQ64C
XC3130A-4VQ64C ECAD Model
XC3130A-4VQ64C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 54 | |
| Number of Outputs | 54 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 3.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | MAX USABLE 2000 LOGIC GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G64 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 64 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP64,.47SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 10 mm | |
| Length | 10 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-64 | |
| Pin Count | 64 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3130A-4VQ64C Datasheet Download
XC3130A-4VQ64C Overview
The XC3130A-4VQ64C chip model is a powerful, high-performance digital signal processing (DSP) chip that is suitable for embedded processing, image processing, and other applications. This model is designed to be used with the HDL (Hardware Description Language) language, making it an excellent choice for those who require a robust and reliable DSP solution.
The original design intention of the XC3130A-4VQ64C was to provide a powerful and reliable DSP solution that is capable of handling complex tasks. This chip model is designed with the latest technology, allowing for future upgrades and improvements. It is also capable of being applied to advanced communication systems, making it a great choice for those who need an advanced solution.
The product description of the XC3130A-4VQ64C chip model includes a large array of features and specifications. It is designed to be used with the HDL language, allowing for a wide range of applications. This model is also capable of handling complex tasks, such as image processing and embedded processing. It is also designed to be reliable and robust, ensuring that it will provide a long-lasting and reliable solution.
In addition to the product description, there are also several case studies and precautions that should be taken into consideration when using the XC3130A-4VQ64C chip model. For example, it is important to ensure that the HDL language is properly used in order to ensure that the chip model is able to perform its intended tasks. It is also important to ensure that the chip model is properly maintained and that any necessary upgrades and improvements are made in order to ensure that the chip model remains reliable and efficient.
Overall, the XC3130A-4VQ64C chip model is an excellent choice for those who require a powerful and reliable DSP solution. It is designed to be used with the HDL language, allowing for a wide range of applications. It is also designed to be robust and reliable, ensuring that it will provide a long-lasting and reliable solution. In addition, the product description and case studies should be taken into consideration when using this chip model, as well as any necessary upgrades and improvements that may be needed.
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