AMD Xilinx
XC3130A-3VQ64I
XC3130A-3VQ64I ECAD Model
XC3130A-3VQ64I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 54 | |
| Number of Outputs | 54 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | MAX USABLE 2000 LOGIC GATES | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G64 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 64 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP64,.47SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 10 mm | |
| Length | 10 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-64 | |
| Pin Count | 64 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3130A-3VQ64I Datasheet Download
XC3130A-3VQ64I Overview
The XC3130A-3VQ64I chip model is an integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other applications. This chip model is designed to be used with HDL (Hardware Description Language) and provides the necessary performance for these applications.
The XC3130A-3VQ64I chip model is designed to meet the needs of the current industry trends in terms of performance and power consumption. It is capable of handling large amounts of data and can be used in a variety of applications such as audio and video processing, communication systems, and embedded systems. The chip model is also designed to be easily upgradable, allowing for future upgrades and expansions as needed.
The original design intention of the XC3130A-3VQ64I chip model was to provide a powerful and reliable chip solution for high-performance applications. This chip model can be used in a variety of applications, including advanced communication systems, and can be easily upgraded and expanded as needed. To meet the demands of these applications, the chip model is designed to be compatible with a variety of new technologies, such as advanced communication protocols, as well as more advanced signal processing techniques.
In conclusion, the XC3130A-3VQ64I chip model is designed to meet the needs of the current industry trends in terms of performance and power consumption. It is capable of handling large amounts of data and can be used in a variety of applications, including advanced communication systems. The chip model is also designed to be easily upgradable, allowing for future upgrades and expansions as needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||