AMD Xilinx
XC3130A-3PQ100I
XC3130A-3PQ100I ECAD Model
XC3130A-3PQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 80 | |
| Number of Outputs | 80 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | MAX USABLE 2000 LOGIC GATES | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3130A-3PQ100I Datasheet Download
XC3130A-3PQ100I Overview
The XC3130A-3PQ100I chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, making it a versatile and efficient choice for many applications.
As the world moves towards an increasingly connected future, the XC3130A-3PQ100I chip model has the potential to be used in a number of network and intelligent scenarios. It could be used to develop and popularize intelligent robots, as well as to facilitate the development of fully intelligent systems. This chip model can be used to create powerful and reliable networks, as well as to process large amounts of data quickly and efficiently.
In order to use the XC3130A-3PQ100I chip model effectively, technical talents such as engineers, computer scientists, and mathematicians are needed. These professionals should be familiar with HDL language, as well as the fundamentals of digital signal processing and embedded processing. They should also be knowledgeable about the latest trends in network and intelligent systems, so that they can use the chip model to its full potential.
In conclusion, the XC3130A-3PQ100I chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It can be used in various network and intelligent scenarios, and is capable of facilitating the development and popularization of future intelligent robots. Technical talents with knowledge in HDL language, digital signal processing, and embedded processing are needed to use the chip model effectively.
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3,724 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $13.3920 | $13.3920 |
| 10+ | $13.2480 | $132.4800 |
| 100+ | $12.5280 | $1,252.8000 |
| 1000+ | $11.8080 | $5,904.0000 |
| 10000+ | $10.8000 | $10,800.0000 |
| The price is for reference only, please refer to the actual quotation! | ||