AMD Xilinx
XC3130A-2VQ100C
XC3130A-2VQ100C ECAD Model
XC3130A-2VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 80 | |
| Number of Outputs | 80 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 2.2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | MAX USABLE 2000 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3130A-2VQ100C Datasheet Download
XC3130A-2VQ100C Overview
The XC3130A-2VQ100C is an advanced chip model designed for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is built with the latest technology, allowing it to be used in advanced communication systems. The chip model was designed with the intention of providing a powerful and reliable solution for these applications.
The XC3130A-2VQ100C is designed to be programmed using the HDL language, which is a hardware description language used to describe the behavior of digital systems. This allows the chip to be customized for specific applications, as the HDL language can be used to create custom logic and memory structures. The chip also has upgrade capabilities, allowing it to be upgraded with new features and capabilities.
The XC3130A-2VQ100C has a range of features, including a high-speed processor, a large memory capacity, and a wide range of I/O ports. The chip is also designed to be highly reliable, with a wide range of safety mechanisms in place. This ensures that the chip can be used in a variety of environments, including industrial, automotive, and medical applications.
In order to use the XC3130A-2VQ100C effectively, it is important to understand the product description and design requirements. This includes a detailed understanding of the chip’s features and capabilities, as well as the HDL language used to program it. It is also important to understand the safety mechanisms in place, as these can be critical in certain applications.
In addition to understanding the product description and design requirements, it is also important to understand the actual case studies and precautions associated with the XC3130A-2VQ100C. This includes understanding the actual performance of the chip in different applications, as well as any potential risks associated with using the chip in certain environments.
Overall, the XC3130A-2VQ100C is a powerful and reliable chip model designed for a variety of applications. By understanding the product description and design requirements, as well as the actual case studies and precautions associated with the chip, users can ensure that they are using the chip effectively and safely.
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|---|---|---|
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