AMD Xilinx
XC3130A-1VQ100C
XC3130A-1VQ100C ECAD Model
XC3130A-1VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 80 | |
| Number of Outputs | 80 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 1.75 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | MAX USABLE 2000 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TFQFP, TQFP100,.63SQ | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3130A-1VQ100C Datasheet Download
XC3130A-1VQ100C Overview
The XC3130A-1VQ100C chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL, a hardware description language, allowing for greater flexibility in programming. The chip model also offers a wide range of features and capabilities, making it a great option for any digital processing project.
The XC3130A-1VQ100C chip model is well-suited to the demands of modern digital processing applications, with its high-speed performance and low power consumption. It is also designed to be compatible with a variety of industry standards, making it easy to integrate into existing systems. Additionally, the chip model has a wide range of features that make it ideal for a variety of digital processing tasks.
The XC3130A-1VQ100C chip model is expected to be in high demand in the future, as it offers a great combination of power, performance, and flexibility. As digital processing applications become more complex, the chip model will be able to keep up with the demands. Additionally, as new technologies are developed, the chip model will be able to take advantage of them, allowing for even more powerful and efficient digital processing.
The XC3130A-1VQ100C chip model offers a number of advantages over other models, including its high-speed performance, low power consumption, and compatibility with a variety of industry standards. Additionally, its wide range of features makes it ideal for a variety of digital processing tasks. With its combination of power, performance, and flexibility, the XC3130A-1VQ100C chip model is sure to be in high demand in the future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||