AMD Xilinx
XC3130A-09VQ100C
XC3130A-09VQ100C ECAD Model
XC3130A-09VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 80 | |
| Number of Outputs | 80 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 1.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | MAX USABLE 2000 LOGIC GATES | |
| Clock Frequency-Max | 370 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | PLASTIC, VQFP-100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Pin Count | 100 |
XC3130A-09VQ100C Datasheet Download
XC3130A-09VQ100C Overview
The XC3130A-09VQ100C chip model is a powerful device that can be used for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other tasks that require the use of HDL language. This chip model has the potential to be applied in networks and intelligent scenarios in the future.
In the era of fully intelligent systems, the XC3130A-09VQ100C chip model can be used to develop and popularize future intelligent robots. This chip model has the capability to process large amounts of data quickly and accurately, making it an ideal choice for powering robots with advanced capabilities. To use this model effectively, technical talents such as software engineers and hardware engineers are needed to design and program the robots. In addition, experienced robotics experts are needed to create the necessary algorithms and programs to make the robots function properly.
The XC3130A-09VQ100C chip model is a powerful tool that can be used to create intelligent robots that can carry out complex tasks. By leveraging the power of this chip model, engineers and robotics experts can create robots that can learn, think, and act on their own. This chip model is a powerful tool that can be used to create robots that can interact with the environment, make decisions, and even complete tasks autonomously.
Overall, the XC3130A-09VQ100C chip model is an incredibly powerful and versatile tool that can be used for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other tasks that require the use of HDL language. In the future, this chip model can be used to develop and popularize future intelligent robots, and technical talents such as software engineers and hardware engineers are needed to use this model effectively. This chip model is a powerful tool that can be used to create robots that can learn, think, and act on their own, making it an ideal choice for powering robots with advanced capabilities.
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