AMD Xilinx
XC3130A-09PC68C
XC3130A-09PC68C ECAD Model
XC3130A-09PC68C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 58 | |
| Number of Outputs | 58 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 1.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | MAX USABLE 2000 LOGIC GATES | |
| Clock Frequency-Max | 370 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J68 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 68 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC68,1.0SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 24.2316 mm | |
| Length | 24.2316 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | QCCJ, LDCC68,1.0SQ | |
| Pin Count | 68 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3130A-09PC68C Datasheet Download
XC3130A-09PC68C Overview
XC3130A-09PC68C is a high-performance chip model developed by Xilinx, a leading manufacturer of programmable logic devices. It is designed to meet the needs of a wide range of applications, such as digital signal processing, embedded processing, and image processing. The chip model is based on the Xilinx Virtex-4 FPGA technology, and it requires the use of HDL language.
The XC3130A-09PC68C chip model offers a range of advantages. Firstly, it has a high-performance processor core, which is capable of handling complex calculations and operations. Secondly, it is designed to handle high-speed data transmission, making it an ideal choice for applications that require high-speed data transfer. Thirdly, the chip model is equipped with a wide range of peripherals and interfaces, allowing it to be easily integrated into a variety of systems. Finally, the chip model is compact and energy-efficient, making it an ideal choice for applications that require a low power consumption.
The XC3130A-09PC68C chip model is expected to be in high demand in the near future, as more and more applications require the use of high-performance chips. The chip model is already being used in a wide range of industries, including automotive, aerospace, medical, and industrial automation, and it is likely to be increasingly used in these and other industries in the future.
The original design intention of the XC3130A-09PC68C chip model was to provide a high-performance processor core for a wide range of applications. The chip model is designed to be easily integrated into a variety of systems, and it is capable of handling complex calculations and operations. The chip model is also designed to be energy-efficient, making it an ideal choice for applications that require a low power consumption.
The XC3130A-09PC68C chip model is capable of being upgraded to meet the needs of more advanced applications. For example, the chip model can be upgraded to support the latest communication systems, such as 5G and beyond. This would enable the chip model to be used in more advanced communication systems, such as those used in autonomous vehicles and the Internet of Things.
In conclusion, the XC3130A-09PC68C chip model is an ideal choice for applications that require high-performance digital signal processing, embedded processing, or image processing. The chip model is equipped with a wide range of peripherals and interfaces, making it easy to integrate into a variety of systems. Moreover, the chip model is capable of being upgraded to support more advanced communication systems, allowing it to be used in a wide range of applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||