AMD Xilinx
XC3120A-3PQ100C
XC3120A-3PQ100C ECAD Model
XC3120A-3PQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | MAX USABLE 1500 LOGIC GATES | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3120A-3PQ100C Datasheet Download
XC3120A-3PQ100C Overview
The Xilinx XC3120A-3PQ100C chip is a powerful integrated circuit that can be used in many applications. It is designed to deliver high-performance, low-power solutions to a wide range of applications. The XC3120A-3PQ100C chip is a highly integrated, field-programmable gate array (FPGA) device that provides a wide range of features, including high-speed logic, embedded memory, and configurable digital signal processing (DSP) blocks.
The original design intention of the XC3120A-3PQ100C chip was to provide a low-cost, low-power, and high-performance solution for a wide range of applications. It is designed to be easily configured to meet specific customer requirements and can be used in a variety of applications, including communications, industrial automation, automotive, and consumer electronics.
The XC3120A-3PQ100C chip is capable of being upgraded to meet the ever-changing needs of the customer. It can be upgraded to support newer technologies and applications as needed, allowing it to be used in the most advanced communication systems. Additionally, the chip can be used in intelligent scenarios, such as voice recognition, machine learning, image processing, and more.
The product description of the XC3120A-3PQ100C chip includes a range of features, such as an optimized architecture, high-speed logic, embedded memory, and configurable DSP blocks. It also offers a low-power solution, with power consumption as low as 0.9W. Additionally, the chip is designed to be easily configured to meet specific customer requirements.
Case studies of the XC3120A-3PQ100C chip have been conducted to demonstrate its effectiveness in various applications. For example, the chip has been used in a variety of industrial automation applications, such as motor control and data acquisition. Additionally, it has been used in automotive applications, such as powertrain control and driver assistance systems.
When using the XC3120A-3PQ100C chip, it is important to ensure that the system is properly configured and that the chip is used in the right application. Additionally, it is important to ensure that the chip is properly maintained and that the customer is aware of any updates or changes that may be necessary.
In conclusion, the Xilinx XC3120A-3PQ100C chip is a powerful, low-cost, low-power, and high-performance integrated circuit that can be used in a variety of applications. It is designed to be easily configured to meet specific customer requirements and can be upgraded to support newer technologies and applications. Additionally, the chip can be used in intelligent scenarios, such as voice recognition, machine learning, image processing, and more.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||