AMD Xilinx
XC3120A-3PC84I
XC3120A-3PC84I ECAD Model
XC3120A-3PC84I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | MAX USABLE 1500 LOGIC GATES | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | PLASTIC, LCC-84 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3120A-3PC84I Datasheet Download
XC3120A-3PC84I Overview
The XC3120A-3PC84I chip model is a high-performance digital signal processor (DSP) designed for embedded processing, image processing, and other applications. It features a wide range of features and capabilities, such as a high-speed processor core, large memory capacity, and a powerful instruction set. It is designed to be used with the HDL (Hardware Description Language) language, making it suitable for advanced applications.
The XC3120A-3PC84I chip model offers a number of advantages over other DSPs. It is designed to be highly efficient, with a low power consumption and a high level of performance. It also has a large memory capacity, which allows for faster processing and more efficient use of resources. Additionally, it is designed to be highly scalable, meaning that it can be easily upgraded and expanded to meet the changing needs of the application.
The XC3120A-3PC84I chip model is an ideal choice for many industries that require high-performance digital signal processing. It is expected to be in high demand in the future, as its features and capabilities are ideal for a wide range of applications. It is also a great choice for advanced communication systems, as it is designed to be highly scalable and can be easily upgraded to meet the changing needs of the system.
The original design intention of the XC3120A-3PC84I chip model was to provide a high-performance, low-power solution for embedded processing, image processing, and other applications. The chip model was designed to be highly efficient, with a low power consumption and a high level of performance. It also has a large memory capacity, which allows for faster processing and more efficient use of resources. Additionally, it is designed to be highly scalable, meaning that it can be easily upgraded and expanded to meet the changing needs of the application.
The XC3120A-3PC84I chip model is a great choice for many industries that require high-performance digital signal processing. Its features and capabilities make it suitable for advanced applications, and its scalability and upgradability make it an ideal choice for advanced communication systems. It is expected to be in high demand in the future, and its features and capabilities are likely to be upgraded and improved to meet the changing needs of the application.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||