AMD Xilinx
XC3120A-1PQ100C
XC3120A-1PQ100C ECAD Model
XC3120A-1PQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 1.75 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | MAX USABLE 1500 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3120A-1PQ100C Datasheet Download
XC3120A-1PQ100C Overview
The XC3120A-1PQ100C is a powerful chip model designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. It is designed to be used with the HDL language, making it an ideal choice for advanced communication systems.
The XC3120A-1PQ100C is designed for flexibility and scalability, allowing for future upgrades and improvements. It is equipped with built-in features such as a high-performance processor, memory, and programmable logic, making it suitable for a wide range of applications. Additionally, it is designed to be easy to use, requiring minimal setup and configuration.
The XC3120A-1PQ100C is designed to offer a range of features, including a high-performance processor, memory, and programmable logic. It also offers a wide range of communication protocols, allowing for reliable and secure communication between devices. Additionally, it is designed to be power-efficient, allowing for long-term operation.
When using the XC3120A-1PQ100C, it is important to adhere to the product description and design requirements, as well as any applicable safety precautions. Additionally, it is recommended to review actual case studies to gain a better understanding of the chip model and its capabilities.
In conclusion, the XC3120A-1PQ100C is a powerful chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be flexible and scalable, allowing for future upgrades and improvements. Additionally, it is designed to be easy to use and power-efficient, making it suitable for a wide range of applications. When using the XC3120A-1PQ100C, it is important to adhere to the product description and design requirements, as well as any applicable safety precautions. Additionally, it is recommended to review actual case studies to gain a better understanding of the chip model and its capabilities.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||